Conference Program

Session 1

Opening, Award Ceremony and Plenary Session

Chairperson

Takashi Matsumoto, Executive Vice Chair (Program)
Hiroto Ohtake,Program Committee Vice Chair

Time	Program
10:00–10:10	Welcome Address Welcome Address Noriaki Matsunaga, Organizing Committee Chair
10:10–10:30	Award Ceremony Award Ceremony Takayasu Saito, Assistant Organizing Committee Chair (Previous Year’s Chair)
10:30–11:10	Plenary Talk : Artificial Intelligence Making AI Real: From infrastructure to SolutionsOnline Chetan Gupta Rackspace Technologies
11:25–12:05	Plenary Talk : Artificial Intelligence Implementing AI Accelerator in Advanced Node Shinnichi Ouchi AIST
12:05–12:45	Plenary Talk : Artificial Intelligence Chips for AI, AI for chips: Redesigning AI from materials up Daisuke Okanohara Preferred Networks

Session 2

Advanced Interconnect

Chairperson

Kazunari Kurita, Program Committee Vice Chair
Keisuke Suzuki, Program Committee Vice Chair

Time	Program
14:05–14:45	Keynote : Advanced CMOS Roadmap The 3D Evolution in Transistor Architectures and its Impact on Advanced Metallization Hans Mertens imec
14:45–15:05	Oral Session Impact of surface RuO2 formation on the electrical and structural stability of Ru thin films ○ Aiga Eguchi and Junichi Koike Department of Materials Science, Tohoku University
15:05–15:25	Oral Session Evaluation of Electrical Characteristics of MIM Capacitors with Interfaces Controlled by the Top Electrode Process ○ Yusuke Nakajima, T. Yoshino, T. Ishizaki, Y. Kagawa, T. Hirano Sony Semiconductor Solutions Corporation

Session 3

Advanced Dry and Wet Processes

Chairperson

Hiroto Ohtake, Program Committee Vice Chair
Hidemi Suemori, Program Committee Member

Time	Program
15:40–16:10	Invited Talk : Deposition, Etching Depth-Controllable Passivation for Isotropic Etching and Advanced Profile Engineering Tsubasa Imamura HITACHI
16:10–16:30	Oral Session N₂-Based Sequential Post-Etch Treatments: A Robust Solution Against TiN Metallic Residues ○ Nicolas Posseme¹ , E.Davin² , A.Artioli² , J.Delbecque² , J.Dubois¹ , F.Gaucher³ , Ph. Brun¹ , T.Chevolleau¹ , O.Rigoutat³ and J.P. Oddou² ¹Université Grenoble Alpes, ²STMicroelectronics, ³Lam Research
16:30–16:50	Oral Session Silicon Etching by Hydrogen Iodide Plasma as New Gas Chemistry ○ Yusei Osada¹ , Daisuke Ohori^1*, Takuya Ozaki¹ , Kazuhiko Endo¹ Daisuke Shimizu² and Hiroto Ohtake² ¹Institute of Fluid Science, Tohoku University, ²Applied Materials Inc.

Session 4

Advanced Packaging I

Chairperson

Akihiro Shimizu, Program Committee Member
Naoko Kato, Financial Vice Chair / Program Committee Member

Time	Program
17:05–17:35	Invited Talk : Bonding mechanism Surface and interface design for reversible interconnection Akitsu Shigetou NIMS
17:35–17:55	Oral Session Operando Strain Imaging of Silicon Dies in Advanced Semiconductor Packages by High-Energy Synchrotron X-ray Diffraction ○ Shinichi Ogawa, Kenji Tamasaku, Yoshinao Harada, Hidekazu Takano, Takashi Kameshima, Taito Osaka, and Takaki Hatsui SPring-8 Center, RIKEN
17:55–18:15	Oral Session A Methodology for Bond Strength Evaluation in Die-Level Fusion Bonding ○ Kenichi Ono, Ryuki Kusakabe, Shumpei Murakami, Marie Sano, Fumihiro Inoue Yokohama National University

Poster Session

Chairperson

Keisuke Suzuki, Program Committee Vice Chair
Hidemi Suemori, Program Committee Vice Chair

Advanced Interconnects (P-01 – P-06)

Poster No.	Title	Presenter / Co-authors	Affiliation
P-01	Room-Temperature Reduction of Cobalt Oxides by Vacuum Ultraviolet Irradiation in an H2/N2 atmosphere with H2O vapor	○ Akihiro Shimizu and Shinichi Endo	Ushio Inc.
P-02	Area-selective Cu-filling into SiO2 via-hole on Ru using CuI-precursor	○ Takumi Nanba¹ , Takashi Fuse² and Satoshi Yamauchi¹	¹Quantum Beam Science & Technology, Ibaraki Univ., ²Tokyo Electron Ltd.
P-03	Realization of weak size dependence in electrical resistivity of topological semimetal Cu-Pd alloys	○ Masahiro Kushibiki¹, Mihyeon Kim¹ , and Yuta Saito^1,2	¹Department of Materials Science, Graduate School of Engineering, Tohoku University, ²Research Center for Green X-Tech, Tohoku University
P-04	Superconducting BEOL for Quantum Devices routing	T.Chêne¹, R. Segaud¹, T.Chevolleau¹, S. Minoret¹, F. Gustavo², F. Lefloch², P. Gergaud¹, M.Bouvier¹, J. Garrione¹, F.Nemouchi¹	¹Université Grenoble Alpes, CEA, LETI, ²Université Grenoble Alpes, CEA, Grenoble INP, IRIG, PHELIQS
P-05	Study on surface grinding for Cu and SiC substrates using polycrystalline diamond grinding tool	○ Haruto Konishi¹, Takashi Fujita¹ , Tomofumi Sawauchi¹, Jun Nishiyama¹ , Yasuo Izumi² and Junji Watanabe³	¹Dept. of Mechanical Engineering, Kindai Univ., ²Shin-Nihon Tech Inc., ³Former Dept. of Mechanical System Engineering, Kumamoto Univ.
P-06	A Novel Robust SiCOH Low-k Dielectric Breaking the Dielectric Constant(k)-Elastic Modulus Trade-off for Advanced BEOL Integration	Zhiwen Chen, Fanyong Ran, Yuexiang Sun, Lingxiao Yu, Guoqing Yin and Xun Gu	Advanced Micro-Fabrication Equipment Inc. (AMEC)

Advanced Dry and Wet Processes (P-07 – P-11)

Poster No.	Title	Presenter / Co-authors	Affiliation
P-07	Effect of Hydrogen Flow Rate on Low-temperature and Catalyst-free Graphene Formation using High-Power Pulsed Sputtering and Plasma CVD	○ Akihiro Iwata¹, Masanor¹, Shinohara¹ , and Takashi Matsumoto²	¹Dept. of Electrical Engineer., Fukuoka Univ., ²Tokyo Electron Technology Solutions Limited
P-08	Polishing Characteristics of C60-absorbed nanodiamond on Difficult-to-Machine Substrates Under High Polishing Pressure	○ Komiya Kotaro¹, Onishi Koki¹ , Shinsuke Ishikawa² , Ichiro Ota², Mitsuteru Mutsuda², Shigehiro Maeda² , Tomoaki Mahiko², Taro Yoshikawa² , and Keisuke Suzuki¹	¹Kyushu Institute of Technology, ²Daicel Corporation
P-09	Plasma-Diagnostic Correlation with High-Rate Silicon Dry Etching Using an Atmospheric-Pressure SF₆ Plasma Jet	Wei-Lun Li, Yu-Pin Lu, Yu Jie Wu and ○ Chun Huang	Department of Chemical Engineering & Materials Science, Yuan Ze University
P-10	Micro-Grooving Technology for Cu Using High-Density Cutting Edges of PCD Blade	○ Tomofumi Sawauchi¹, Takashi Fujita¹ , Haruto Konishi¹ , Jun Nishiyama¹ , Junji Watanabe² , Yasuo Izumi³	¹Kindai University, ²Kumamoto University, ³Shin-Nihon Tech Inc.
P-11	Evaluation of Hydroxyl Groups on Glass Substrates for silane coupling pretreatment to enhance catalytic nuclei for plating	○ Saki Nishikawa, Kaito Katayama, Takeyasu Saito, Naoki Okamoto , Shinichi Endo	Dept. of Chemical Engineering, Osaka Metropolitan Univ.

Atomic Layer Process (P-12 – P-17)

Poster No.	Title	Presenter / Co-authors	Affiliation
P-12	Research on Improving Step Height Reduction Properties Using Polycarboxylic Acid	○ Hikaru Yokota, Keisuke Suzuki Takuya Honda, Midori Goda	Kyushu Institute of Technology,NOF CORPORATION, Chidori Research Lab.
P-13	A Pumping-Assisted Nucleation Step for High-Quality Co Film Growth by Atomic Layer Deposition from Bis(diisopropylbutanamidinate)cobalt	○ Yohichiroh Numasawa¹ , Masahiro Kawano² , Hiroshi Sudoh¹ , Yoshiharu Hasegawa¹ , Ronel Christian Intal ROCA² , Masato Ishikawa¹ , Itaru Kamiya² , Yoshio Ohshita² , and Hideaki Machida¹	¹Gas-Phase Growth LTD., ²Toyota Technological Institute
P-14	ALD Molybdenum Carbide Sacrificial Seed Layer for Cu/Mo Hybrid Metallization	Min Seok Kim, Eung Seon Yeon, and Jeong Hwan Han	Department of Materials Science and Engineering, Seoul National University of Science and Technology
P-15	Atomic Layer Deposition of Ru Seed Layers for Cu Electroplating in Through-Glass Via Applications	Min Young Park¹, Ye Seul Kang¹, Jin Yong Kim², Min Soo Kim², Sung Jin Kim², Jeong Hwan Han¹	¹Dept. of Materials Science and Engineering, Seoul National University of Science and Technology (Seoultech), ²KCC Central Research Institute
P-16	Effect of Vacuum Ultraviolet Light Irradiation on Deposition Behavior during Atomic Layer Deposition using Metal Alkoxide	So Kumano , Mika Kawamoto , Takashi Hirotani, Shinichi Endo, Takeyasu Saito and Naoki Okamoto	Dept. of Chemical Engineering, Graduate School of Engineering, Osaka Metropolitan Univ.
P-17	Plasma Enhanced Atomic Layer Deposition of Cu Seed Layer for Conformal Electroplating in Advanced Packaging	Junzhou Long¹ ,Yuan Li² , Xuzhong Cong³ , Yufeng Zhuang³ , Shuliang Lv³ and Xun Gu³	¹School of Mechanical Science and Engineering, Huazhong University of Science and Technology, ²School of Microelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan University, ³Advanced Micro-Fabrication Equipment Inc.

Materials Science and Technology (P-18 – P-23)

Poster No.	Title	Presenter / Co-authors	Affiliation
P-18	Study on High-Speed Polishing Methods using Implant CMP	○Sota Ueda¹ , Yuya Uchida² , Akira Sada², Taido Kurauchi², Takeshi Matsumoto² and Keisuke Suzuki¹	¹Kyushu Institute of Technology, ²Nissin Ion Equipment Co., Ltd.
P-19	Effects of Powder Configuration in Ag–Cu–Ti Brazing Pastes on Interfacial Microstructure and Joint Characteristics of AMB Substrates	○Yun-Chan Kim^1,2, Dong-Yurl Yu¹, Junhyuk Son¹ , Sang Eun Han¹ , Eunsuk Yoon³, Dongjin Byun² and Junghwan Bang¹	¹Regional Industry Innovation Department, Korea Institute of Industrial Technology (KITECH), ²Department of Materials Science and Engineering, Korea University, ³ntegration of People & Technology (IPT)
P-20	Development of Aluminum Nitride Thin Film Deposition Process for Heat Spreader Applications	○ Kazuyuki Sueyoshi, Yusuke Ujihara, Masaki Hasegawa, Toru Kikuchi, Shunsuke Sasaki	Institute of Advanced Technology, ULV AC, Inc．
P-21	Dissolvable Positive-Photoresist Templates for Stress-Free Replication of High-Aspect-Ratio Nanoimprint Structures	○ Shuo Chen , Yue Zhang , Hao Cao , Chengqun Gui	School of Integrated Circuits, Wuhan University
P-22	ALD-Grown Anisotropic PtCoO₂ Thin Films for Narrow-Dimension Interconnects	Joonho Moon and ○ Kiyoung Lee	Department of Materials Science and Engineering, Hongik University
P-23	Buffer-Layer-Free c-axis aligned Kagome-Metal CoSn Thin Films toward Via interconnects	○ Youngeun Joo¹ , Sungmin Jung^1,2 , Gayun Kim¹, Seung-heon Chris Baek² , and Kiyoung Lee¹	¹Department of Materials Science and Engineering, Hongik University, ²Center for Semiconductor Technology

Advanced Packaging (P-24 – P-27)

Poster No.	Title	Presenter / Co-authors	Affiliation
P-24	Grain Coarsening Behavior in Electrodeposited Cu for Low-Temperature Hybrid Bonding	○ Masahiro Sawa¹, Jinta Nampo¹, Tatsuki Sekine¹ Murugesan Mariappan¹ and Takafumi Fukushima²	¹JCU CORPORATION, ²Tohoku University
P-25	Influence of Sb Content on Interfacial Evolution and Mechanical Reliability of Sn-Sb Solder Joints during Isothermal Aging	Beom Jin Kim , Yong-Ho Ko , Junhyuk Son , and Dong-Yurl Yu	Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology (KITECH)
P-26	Interfacial Reactions and Mechanical Properties of Sn-Ag-Cu and Sn-Bi Combined Pb-Free Solder Joints under Multiple Reflow Conditions	○ Jahyeon Kim¹ , Dong-Yurl Yu¹ , Sojeong Lee¹, Junhyuk Son¹ , Won Bin Im² and Yong-Ho Ko¹	¹Advanced Packaging Integration Center (APIC), Korea Institute of Industrial Technology (KITECH), ²Divison of Materials Science & Engineering, Hanyang University
P-27	Effect of Plating Additives on Copper Filling in Through-Glass Vias: Leveler-Dependent Electrochemical and Microstructural Characteristics	○ Jinyoung Park, Seonghyuk Moon, Heewon Park, Taegyeong Gu, Nayoung Kang and Kiyoung Lee	Department of Materials Science and Engineering, Hongik University

Session 5

Atomic Layer Process
（Joint Session with the JSAP Atomic Layer Process Research Group）

Chairperson

Hiroto Ohtake, Program Committee Vice Chair
Seiji Muranaka, Program Committee Member

Time	Program
10:00–10:30	Invited Talk : 3 from JAPAN-KOREA ALP Workshop Towards Intelligent and Sustainable ALD Research: On-Demand Precursor Delivery and In-Situ Imaging Ellipsometry for Accelerated Process Development Takeshi Momose Kumamoto University
10:30–11:00	Invited Talk : 3 from JAPAN-KOREA ALP Workshop Atomic Hydrogen for Oxygen-Free Metal ALD and Bottom-Up Interconnect Fill Han-Bo-Ram Lee Graduate School of Semiconductor Materials & Devices Engineering, Ulsan National Institute of Science and Technology (UNIST)
11:00–11:20	Oral Session Defect Modulation and Interface Engineering of Top-Gate SnO₂ Transistors Using Atomic Layer Deposition ○ Jung-Tae Kim, Jiyeong Yang and Woo-Hee Kim Major in Advanced Materials and Semiconductor Engineering and Department of Material Science and Chemical Engineering, Hanyang University
11:20–11:40	Oral Session Enhancing the Structural and Electrical Properties of Metal Thin Films via Electron-Beam Post-Treatment ○ Jiwoo Oh, Yongju Kwon, and Woo-Hee Kim Department of Materials Science and Chemical Engineering, Hanyang University

Session 6

Materials Science and Technology

Chairperson

Kan Takeshita, Program Committee Member
Takafumi Fukushima, Program Committee Member

Time	Program
13:00–13:30	Invited Talk : New Materials, Simulation Metallic delafossites for low-resistivity advanced interconnectsOnline Takayuki Harada NIMS
13:30–13:50	Oral Session Analytical and Computational Study of Early-Stage Reactions in Alkaline Wet Etching of Si and Si1−xGex ○ Tomoki Nara¹ , Haru Sendo², Raimu Endo ¹ , Yoshiko Tamaki ¹ , Kei Ikeda ¹ , and Daisuke Yuhara ¹ ¹Mitsubishi Chemical Corporation, ²Mitsubishi Chemical Taiwan
13:50–14:10	Oral Session Stealth Laser–Induced Subsurface Gettering Layer Formation for Advanced Chiplet Integration ○ Kazunari Kurita^1,3 and Hiroki Kondoh ^1,2 ¹Center of Plasma Nano-interface Engineering, Kyushu University, ²Graduate School of Information Science and Electrical Engineering, Kyushu University,³SUMCO Joint Research Development of 3D-Si Integrated Devices, Kyushu University
14:10–14:30	Oral Session Epitaxial CoSn thin films on 300-mm-compatible substrates ○ Tomoya Nakatani¹, Kritika Sur¹, Mevhibe Dilara Pütkül¹, Yusuke Ikeda¹ , Nattamon Suwannaharn², Rohit Dahule², Taisuke Sasaki², and Ryoji Sahara² ¹Research Center for Magnetic and Spintronic Materials, National Institute for Materials Science, ²Research Center for Structural Materials, National Institute for Materials Science
14:30–14:50	Oral Session Area Selective Deposition by PECVD Using an Added Etchant ○ Kenji Ouchi¹, Masato Morishima², Kazuki Yamada¹, Yuji Otsuki³ , Sena Fujita¹ , Yasuo Takeuchi¹ , Takaaki Tsunomura² and Kota Umezawa¹ ¹Tokyo Electron Technology Solutions Limited, ²Tokyo Electron Limited, ³Tokyo Electron America, Inc.

Session 7

Advanced Packaging II

Chairperson

Takashi Hirotani, Program Committee Member
Hideki Shimizu, Program Committee Member

Time	Program
15:05–15:35	Invited Talk : Hybrid bonding Development of a test platform to evaluate process variables for copper hybrid bonding technology Kyungho Park Korea Advanced Nano Fab Center
15:35–16:05	Invited Talk : 3DI Challenges for half micron pitch damascene pattern fabrication for organic RDL in next generation’s Chiplet technology Yoshihiko Hirai Osaka Metropolitan University
16:05–16:25	Oral Session Design and Evaluation of a Dual-Functional Polymer for Optical Waveguide Cladding and Hybrid Bonding Dielectric ○ Toshihiko Katayama¹, Kazuki Inoue¹, Motoya Kaneta¹, Yuma Tanaka¹ , and Takafumi Fukushima² ¹Sumitomo Bakelite Co., Ltd. , ²Tohoku University
16:25–16:45	Oral Session CVD Stress-Buffer Liner for Reliable Through-Glass Vias in Panel Level Packaging ○ Naoyuki Sato Applied Materials Inc.
16:45–17:05	Oral Session Self-Assembly Assisted Hybrid Bonding for 3D Integration: Surface/Interface Characterization and Alignment Accuracy Evaluation ○ Kota Sasaki¹ , Bungo Tanaka¹, Ryoichi Sato¹ , Hayato Hishinuma², Tetsu Tanaka^1,3and Takafumi Fukushima^1,3 ¹Dept. of Mechanical Systems Engineering, Graduate School of Engineering, Tohoku Univ., ²Yamaha Robotics Co., Ltd., ³Dept. of Biomedical Engineering, Graduate School of Biomedical Engineering, Tohoku Univ.
17:05–17:25	Oral Session Investigation of 1.4 µm-pitch Chip-on-Wafer Hybrid Bonding and the Effects of Bonding Misalignment ○ Sota Mochizuki, Itsuki Imanishi, Toru Osako, Masanori Chiyozono, Kan Shimizu, and Yoshihisa Kagawa Sony Semiconductor Solutions Corporation

Session 8

Closing

Time	Program
17:25–17:30	Closing Remarks Closing Remarks Noriaki Matsunaga, Organizing Committee Chair

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