advanced
metallization
conference

ADMETA has built a long history and made significant contributions to the development of interconnect technologies that support advanced semiconductor devices. This year marks the memorable 35th ADMETA conference. As always, ADMETA will cover a wide range of fields related to interconnect technology, such as materials, processes, equipment, devices, circuit design, integration, measurement, assembly, and packaging, providing a forum for researchers and engineers from industry, government, and academia to engage in lively discussions from fundamentals to applications.
In recent years, as AI semiconductors have been driving semiconductor technology, unprecedented attention has been focused on high-performance transistors for advanced logic devices, memory technologies with large capacity and wide bandwidth, and advanced interconnect and packaging technologies that maximize their potential while significantly reducing power consumption. These are precisely the areas that ADMETA has long focused on, and I am convinced that their importance as foundational technologies supporting semiconductors in the AI era will only continue to grow.
The theme for 2026 is “AI Enablers: Exploring the Frontiers of Advanced Interconnect and Packaging Technologies.” This theme reflects our commitment to spotlighting interconnect and packaging technologies that enable even higher performance AI semiconductors, providing an overview of the latest technological advances and future directions, and contributing to the creation of next-generation devices.
Under this theme, we have planned an attractive and comprehensive program again this year, including tutorial sessions (Japanese only), plenary lectures, invited talks, and poster sessions. We sincerely look forward to the sharing of the latest achievements and original ideas in interconnect and packaging technologies.
We look forward to your active participation and paper submissions. We are excited to see you in Tokyo.