&ProcessesNew materials, Metal, Alloy, Dielectrics, Low-k, High-k, SAMs,Topological semi-metal, 2D material, Graphene, Carbon nanotube,PVD, CVD, ALD, SOD, Plating, CMP, Supercritical Fluid, Reflow,Material Informatics, Cheminformatics
&ReliabilityMetallization, Etching, Lithography, NIL, EBDW, FSAV,Semi-damascene, Advanced Patterning, Pattern Transfer, Cleaning,Barrier Metal, Contact, Air Gap, Hard Mask, Parasitic Capacitance,EM, SIV, TDDB, Defect Detection and Analysis,Failure Mechanism and Modeling
&MEMSBEOL Transistor, MRAM, PCRAM, ReRAM, Optical interconnect,Wireless interconnect, Carbon based interconnect, Sensor,Flexible Electronics, Energy Harvesting
Failure Analysis, 3DAP, CD-SEM, DLS, EBSD, EDS/EDX, EELS,Ellipsometer, ESCA/XPS, FIB, FT-IR, LEED/RHEED, LFA/TDTR,OBIRCH, ARPES/HAXPES/PES, Photoluminescence,Positron Annihilation, Raman, RBS/HFS, SIMS, SPM,STEM/TEM, STM, TDS, TXRF, XAFS, XRD, XRR, XRT
&ProcessesBonding Interface Dielectric/other Materials,Bonding Pad metallization, Bonding, Thinning/Planarization, Trimming, TSV, Revealing, Warpage/TTV Control,Heat dissipation, Gap filling, Organic/Inorganic RDL,Advanced core materials, Sealing/Molding
&ReliabilityCu-Cu hybrid bonding, CoW, WoW, nano/high-aspect TSV,Heterogeneous Integration
&PhotonicsHBM, HBF, 3D stacked logic, interposer, RDL,organic or glass core substrate, CPO,EIC/PIC (Waveguide, Diffraction grating, Modulator,Photodetector), Active and Passive devices (Regulator, Bridge, Capacitor, Inductor, Resistor), 2.xD/3D Arch., Power distribution Arch.,Thermal dissipation Arch.
Hi & Precise Stacks TTV, Alignment,Void measurement, Stress, and Thermal Analysis
