| Year | Event |
|---|---|
| Spring 1984 | The first VLSI Multilevel Interconnection Conference (VMIC) was organized by the IEEE, reflecting growing interest in multilayer LSI interconnect technology. |
| Fall 1984 | Dr. Robert S. Blewer of Sandia National Laboratories established the first Tungsten Workshop in Albuquerque, New Mexico, USA. |
| 1985 | The 2nd Tungsten Workshop was held in Albuquerque. |
| Spring 1986 | Proceedings of the 1st and 2nd Workshops were jointly published by MRS as the “Red Book.” Annual publication continued thereafter. |
| March 1988 | The symposium “CVD Technology for VLSI” was organized by the ECS Japan Chapter. |
| 1988 | At the 5th Tungsten Workshop in Albuquerque, Japanese organizers were formally requested to prepare a workshop in Japan. |
| September 20–21, 1989 | The US Tungsten Workshop was held in San Mateo, California. |
| October 19–20, 1989 | The first Japanese Tungsten Workshop was held at the Centennial Hall of Tokyo Institute of Technology. |
| 1991 | The conference name was changed to Advanced Metallization for ULSI Applications. The second Japanese conference was held. |
| 1993 | The third Japanese conference was held at the Sanjo Conference Hall, University of Tokyo. |
| 1995 | The fourth Japanese conference was held. ADMETA thereafter became an annual conference. |
| 1996 | Due to a shortened preparation period, the conference focused mainly on invited talks and tutorials. |
| Around 1996 | One-day tutorial programs for engineers from equipment and related industries were introduced in earnest. |
| 1997 | The conference adopted a standard format including contributed papers and became firmly established as an annual event. |
| Around 1997 | The name “ADMETA” became widely established on the Japanese side. |
| 1998 | The conference name was standardized as Advanced Metallization Conference (AMC), forming the basis of the current naming system. |
| 2000 | The conference was officially approved by the Silicon Technology Subcommittee of the Japan Society of Applied Physics. |
| 2003 | The ADMETA Award for best papers was established. |
| 2004 | The Technical Achievement Award was introduced. |
| 2000s onward | The chairmanship began alternating between academia and industry, symbolizing industry–academia collaboration. |
| 2010s | Conference topics expanded significantly to include Cu/Low-k interconnects, CMP, reliability science, MEMS/RF integration, packaging, and advanced process technologies. |
| 2020–2021 | The conference adapted to online formats during the COVID-19 period. |
| From 2022 | The on-site and online hybrid conference format, including tutorials and technical sessions, was introduced. |
