ADMETA (Advanced Metallization Conference) is an international conference focusing on interconnect technologies in semiconductor devices. It has been held for many years and provides a platform for active discussions among researchers and engineers from industry, academia, and government. The conference covers a wide range of fields including materials, processes, devices, circuit design, packaging, equipment, and evaluation technologies.
The year 2026 marks the 35th edition of the conference.
Advanced Metallization Conference 2026 (ADMETA 2026)
October 7, 2026 (Wed) – Tutorial
October 8 (Thu) – 9 (Fri) – Conference
Hybrid (On-site + Online)
The University of Tokyo, Takeda Building
2026AI Enablers: Advancing Cutting-edge Interconnect and Packaging Technologies
Takeda Hall, 5th Floor of Takeda Building, The University of Tokyo (Asano Campus)
2-11-16 Yayoi, Bunkyo-ku, Tokyo, Japan. 113-8656
Google Map
グループリンクThere is a possibility that the holding method of conference will be changed or the number of people will be limited depending on the situation.
Please check the latest information.
The webinar tool uses Zoom webinar.
During the question and answer session, questions will be accepted via chat. Please specify your name and your affiliation and enter your question briefly. The moderator selects a representative question and conveys it to the speaker. You cannot ask questions directly by voice.
