admeta advanced
metallization
conference

KEYNOTE &
INVITED SPEAKERS

Keynote

session 2

Advanced Interconnect

The 3D Evolution in Transistor Architectures and its Impact on Advanced Metallization

Hans Mertens

Affiliation
Principal Member of Technical Staff at imec
Biography
Hans Mertens is a principal member of technical staff at imec. He received a M.S. Degree in applied physics from Eindhoven University of Technology (2002) and a PhD degree in physics from Utrecht University (2007), both in The Netherlands. Prior to joining imec, he worked at NXP Semiconductors as Senior Scientist in the field of SiGe heterojunction bipolar transistors for RF applications.
His current research interests include novel integration solutions for advanced CMOS transistor architectures, including nanosheet FETs, forksheet FETs, and CFETs. He has published over 40 papers at the IEEE Symposia on VLSI Technology (VLSI) and at International Electron Devices Meetings (IEDM), of which 8 papers as a first author.

Invited Talks

session 3

Advanced Dry and Wet Processes

Depth-Controllable Passivation for Isotropic Etching and Advanced Profile Engineering

Tsubasa Imamura

Affiliation
Senior Researcher at the Research & Development Group, Hitachi, Ltd.
Biography
Tsubasa Imamura is a Senior Researcher at the Research & Development Group, Hitachi, Ltd., where he leads the development of electron microscopes.He received a Ph.D. in Electronic Engineering from Nagoya University in 2021.
Prior to joining Hitachi, he worked at Toshiba, Toshiba Memory Corporation, and Kioxia Corporation, accumulating a total of 14 years of industry experience, including approximately 10 years in dry etching process development for 3D NAND devices.His research interests include semiconductor manufacturing processes, as well as gas etching and plasma etching processes.He has published four peer-reviewed journal articles and holds seven patents.

session 4

Advanced Packaging I

Surface and interface design for reversible interconnection

Akitsu Shigetou

Affiliation
Principal Researcher at the National Institute for Materials Science (NIMS)
Biography
Dr. Akitsu Shigetou is a Principal Researcher at the National Institute for Materials Science (NIMS). She received her B.E., M.E., and Ph.D. in Precision Engineering from the University of Tokyo.
Her research focuses on the design and creation of functional surfaces and interfaces to achieve precise control over bonding and debonding properties. While this expertise is applied to semiconductor integration and packaging, her work primarily addresses the underlying surface science governing material integration. She also serves as a Visiting Professor at the University of Tokyo, bridging fundamental interface engineering with industrial applications.

session 6

Materials Science and Technology

Metallic delafossites for low-resistivity advanced interconnects

Takayuki Harada

Affiliation
Principal Researcher, National Institute for Materials Science (NIMS), Japan
Biography
Takayuki Harada is a principal researcher at the National Institute for Materials Science (NIMS), Japan. He received a Ph.D. degree in applied chemistry from the University of Tokyo (2011). Prior to joining NIMS, he worked at Institute for Solid State Physics in UTokyo, Max Planck Institute for Solid State Research, and Institute for Materials Research in Tohoku University.
He is focusing on exploratory research on thin-film heterostructures.
He has published about 40 peer-reviewed papers and holds 2 patents. Recent honors include the MEXT Prize for Young Scientists.

session 7

Advanced Packaging Ⅱ

Development of a test platform to evaluate process variables for copper hybrid bonding technology

Kyung-Ho Park

Affiliation
Principal Researcher
Korea Advanced Nano Fab Center (KANC), Korea
Biography
Kyung-Ho Park is a principal researcher at Korea Advanced Nano Fab Center (KANC), where he leads the advanced packaging TF.
He received a Ph. D. in applied physics from Ajou University in Korea (2002).
Prior to joining the advanced packaging TF, he worked at the convergence technology division as a general manager (vice president).
His research interests include semiconductor advanced packaging technologies such as Cu hybrid bonding, silicon bridge, and RDL (Redistribution Layer).
He has published 81 peer-reviewed articles and holds 43 patents. Recent honors include a commendation from the Minister of Science and ICT of the Republic of Korea.

Challenges for half micron pitch damascene pattern fabrication for organic RDL in next generation’s Chiplet technology

☆ Yoshihiko Hirai

Affiliation
Professor of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Metropolitan University
Biography
Y. Hirai, 1980-1997 Matsushita Electric Industrial Co., 1997-2020 Osaka Prefecture University, 2020 Osaka Metropolitan University, Appointed Professor of Osaka Metropolitan University

Masaru Sasago

Affiliation
Professor of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Metropolitan University
Biography
M. Sasago, 1978-2021 Matsushita Electric Industrial Co., 2021 Osaka Metropolitan University,  Appointed Professor of Osaka Metropolitan University

Shinji Kishimura

Affiliation
Visiting Professor of Physics and Electronics Engineering, Graduate School of Engineering, Osaka Metropolitan University
Biography
K. Kishimura, 1986-1998 Mistubishi Electric, 1999-2014 Panasonic Corp., 2014-2016 University of Tokyo, 2016-2025 Kyoto University, 2025 Osaka Metropolitan University, Visiting Professor of Osaka Metropolitan University