Advanced Metallization Conference 2021
30thAnniversary, Asian Session

Advanced Metallization Conference 2021
30th Asian Session
Oct. 12-15, 2021, All On-Line

Oct.12-13: Tutorials and Special Sessions
Oct.14-15 : Conference

Sponsored by
The Japan Society of Applied Physics

Co-Sponsored by
 The Institute of Electronics, Infomration and Communication Engineers (IEICE)
 The Japan Institute of Metals and Materials (JIM)
The Surface Finishing Society of Japan (SFJ)
 The Japan Society for Precision Engineering (JSPE)
 The Institute of Electrical Engineers of Japan (IEEJ)
The Japan Institute of Electronics Packaging (JIEP)
 The Japan Society of Vacuum and Surface Science (JVS)
IEEE EDS Japan Joint Chapter
 ECS Japan Section

Financially supported by
The Murata Science Foundation
The Foundation for Technology Promotion of Electronic Circuit Board

  The ADMETAPlus is heading for the 30th historical meeting and has a long record of important contributions to practical progress for advanced MPU and various memory devices. In recent years, the importance of interconnect technology for realizing low resistance, large integration, rich function, low cost, and high reliability is increasing in various device application fields beyond silicon electronics.
  This conference is focusing interconnects technology and science related to materials, processes, device design, assembly, equipment, cost performance, and characterization. We will conduct comprehensive discussions widely from basics to applications with researchers and engineers from industry, government, and academia. We are looking forward to new developments in interconnect technology fields and contributing to the growth of semiconductor industry in the Asian area. Due to the infection status of the COVID-19, ADMETAPlus 2021 will be held virtually.
  ADMETAPlus 2021 General Chair:
    Kazuyoshi Maekawa (Renesas Electronics Corporation)

Notation based on the Specified Commercial Transaction Act