Conference Program

October 13-14, 2022
★ General Sessions
1) Advanced Integration and Process
2) Advanced Metallization
3) CMP and Cleaning
4) Emerging Technologies (STT-MRAM, ReRAM)
5) Next Generation Interconnect (Carbon, Optical Interconnect etc.)
6) Thin films and Dielectrics
7) 3D Device, TSV and Packaging

All sessions will be conducted in English.

Tutorial     Conference Program
Notation based on the Specified Commercial Transaction Act