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 Special issue of JJAP
 Invited Speaker
 Panel Discussion
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IWAPS Joint Conference


On the day preceding the conference, a short course summarizing the current status of advanced ULSI metallization and interconnects will be presented, utilizing the collective wisdom of several leaders in the field.

Tutorial Program

1) Trends in Cu / low-k Integration and Future, Takeshi Nogami (IBM)

2) Introduction to Atomic Layer Deposition, Yukihiro Shmogaki (University of Tokyo)

3) Interconnect Technology for Nonvolatile Memories, Masahiro Moniwa (Tokyo University of Technology)

4) Trends in Semiconductor Market and Future, Wataru Izumiya (The Semiconductor Industry News)

5) Advanced Scaling and Wiring Technology, Hitoshi Wakabayashi (Tokyo Institute of Technology)

6) Introduction and Trend of TSV/3DIC Techonology, Hiroaki Ikeda (Napra)

7) Panel Discussion

*Official language of the short course is Japanese.
*Title of each lectures are tentative.

Notation based on the Specified Commercial Transaction Act 

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