Conference Topics of Interest
Integration: Structure, Performance, Resistance, Capacitance,
Evaluation, Analysis, etc.
Reliability Science and Failure Analysis:
EM, SIV, TDDB, Measurement, Evaluation, Defect Inspection,
Yield Improvement, Process Variation Modeling, etc.
Metallization: PVD, CVD, ALD, ECD, Barrier Metal, Nucleation Layer, Seed
Layer, Alloy, Supercritical, New Materials,
Low-k Dielectric: CVD, ALD, SOD, Porous Films, New Materials,
Adhesion, Interface Reaction, Air Gap, Evaluation, etc.
CMP: Planarization Technology, Slurry, Pad, Dress,
End Point Detection, Cleaning, Anti-Corrosive
Contact: Silicide, Interface, Solid Phase Reaction,
Shallow Junction, Crystal
Properties, Carrier Transport,
MEMS/RF: Structure, Materials, Packaging, Deposition
Tech., Etching Tech., CMP, Electroplating, Switch, Inductor, Varactor,
Resonator, Transmission Line, etc.
Emerging Technology: Active Wiring, Memristor, Sensor, Electronic
Luminescence, Silicon Photonics,
Flexible Electronics, Energy
Organized-Session Topics of Interest
Backend Device Technologies Session: Tech. for Embedding Devices (MRAM, PCRAM,
ReRAM, DRAM etc.), Science
and Process of
Devices, Electrode, Metallization,
Nanocarbon Session: Graphene, Carbon Nanotube, Deposition, Growth,
Joint-Session (with IWAPS) Topics of Interest
3D and Packaging Session: TSV (Etching, CVD, PVD, Plating, CMP, etc.),
Stacking Technologies (COW, WOW), Thinning,
Planarizaiton, Flattening, Bonding, TMV, Bump, Stress Analysis, Thermal Management,
Individuating, Redistribution Layer, Sealing,
Cooling, Reliability, Test and Inspection,