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IWAPS Joint Conference

 Panel Discussion

Time and Date
Oct. 22, 2014, 16:15 - 17:15 (60min.)

On the day preceding the conference, a Panel Discussion focusing on the next generation metallization and interconnects technologies will be held after the Tutorial session. This Panel Discussion is free to participate for the Conference and Tutorial attendees.
The theme of panel discussion is a prospective of future LSI/BEOL technology.
Panelists and attendees will discuss what kind of future BEOL technology will be adapted in future LSI and what is a critical obstacles if these candidate can not be promising. We will try to find out solutions for these red brick areas and make a consensus.

Discussion Panelists
1) Takeshi Nogami (IBM)
2) Masahiro Moniwa (Tokyo University of Technology)
3) Hitoshi Wakabayashi (Tokyo Institute of Technology)
4) Hiroaki Ikeda (Napra)
5) Shintaro Sato (Fjitsu Laboratory)

ADMETA Plus 2014 Program Chair
Takenao Nemoto (Tokyo Electron)

*Official language of the Pane Discussion is Japanese.

Notation based on the Specified Commercial Transaction Act 

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