Sponsorship & Exhibition Opportunities

◾️ About the Conference


ADMETA (Advanced Metallization Conference) is an international conference focusing on interconnect technologies in semiconductor devices. It has been held for many years and provides a platform for active discussions among researchers and engineers from industry, academia, and government. The conference covers a wide range of fields including materials, processes, devices, circuit design, packaging, equipment, and evaluation technologies.
The year 2026 marks the 35th edition of the conference.

◾️ Overview


Conference Name: Advanced Metallization Conference 2026 (ADMETA 2026)


Dates: October 7, 2026 (Wed) – Tutorial / October 8 (Thu) – 9 (Fri) – Conference


Format: Hybrid (On-site + Online)


Venue: The University of Tokyo, Takeda Building


◾️ Theme 2026

AI Enablers: Advancing Cutting-edge Interconnect and Packaging Technologies

◾️ Sponsorship Opportunities


ADMETA 2026 invites companies and organizations to participate as sponsors. Sponsorship provides valuable opportunities to promote your technologies and enhance your corporate presence among researchers and engineers in the semiconductor field.

◾️ Sponsorship Plans & Benefits

◾️ Common Benefits (All Tiers)

• Banner advertisement on official website
• Promotional video screening (within 1 minute)
• Company name listed in downloadable materials
• Media access for PR representatives
• Content usage for SNS (with conditions)

◾️ Exhibition Opportunities

• JPY 100,000 per slot (includes 2 on-site + 2 online passes)
• Exhibition booth during the conference
• Banner advertisement on official website
• Company name listed in materials

◾️Contact

For inquiries regarding sponsorship and exhibition, please contact:

ADMETA 2026 Secretariat

E-mail: jimukyoku@admeta.org
   
Web: https://www.admeta.org/