ADMETA 2026
Advanced Metallization Conference 2026
Scope and Topics
Advanced Interconnect Technology
● Materials & Processes
New materials, Metal, Alloy, Dielectrics, Low-k, High-k, SAMs,
Topological semi-metal, 2D material, Graphene, Carbon nanotube,
PVD, CVD, ALD, SOD, Plating, CMP, Supercritical Fluid, Reflow,
Material Informatics, Cheminformatics
● Integration & Reliability
Metallization, Etching, Lithography, NIL, EBDW, FSAV,
Semi-damascene, Advanced Patterning, Pattern Transfer, Cleaning,
Barrier Metal, Contact, Air Gap, Hard Mask, Parasitic Capacitance,
EM, SIV, TDDB, Defect Detection and Analysis,
Failure Mechanism and Modeling
● Device, Architecture & MEMS
BEOL Transistor, MRAM, PCRAM, ReRAM, Optical interconnect,
Wireless interconnect, Carbon based interconnect, Sensor,
Flexible Electronics, Energy Harvesting
● Metrology
Failure Analysis, 3DAP, CD-SEM, DLS, EBSD, EDS/EDX, EELS,
Ellipsometer, ESCA/XPS, FIB, FT-IR, LEED/RHEED, LFA/TDTR,
OBIRCH, ARPES/HAXPES/PES, Photoluminescence,
Positron Annihilation, Raman, RBS/HFS, SIMS, SPM,
STEM/TEM, STM, TDS, TXRF, XAFS, XRD, XRR, XRT
Advanced Packaging
● Materials & Processes
Bonding Interface Dielectric/other Materials,
Bonding Pad metallization, Bonding, Thinning/Planarization,
Trimming, TSV, Revealing, Warpage/TTV Control,
Heat dissipation, Gap filling, Organic/Inorganic RDL,
Advanced core materials, Sealing/Molding
● Integration & Reliability
Cu-Cu hybrid bonding, CoW, WoW, nano/high-aspect TSV,
Heterogeneous Integration
● Device, Architecture & Photonics
HBM, HBF, 3D stacked logic, interposer, RDL,
organic or glass core substrate, CPO,
EIC/PIC (Waveguide, Diffraction grating, Modulator,
Photodetector), Active and Passive devices
(Regulator, Bridge, Capacitor, Inductor, Resistor),
2.xD/3D Arch., Power distribution Arch.,
Thermal dissipation Arch.
● Metrology
Hi & Precise Stacks TTV, Alignment,
Void measurement, Stress, and Thermal Analysis
