Session 1: Opening, Award Ceremony and Plenary Session

Shin-ichi O’uchi
Team Leader

AIST-UTokyo AI Chip Design Open Innovation Laboratory (AIDL)
National Institute of Advanced Industrial Science and Technology (AIST), Japan

Biography

Shin-ichi O’uchi received Ph.D. degrees in information and communication engineering from the University of Tokyo in 2002. He was with Toshiba Corporation from 2002 to 2005. He joined National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Japan, in 2005. He is currently a laboratory team leader of AIST-UTokyo AI Chip Design Open Innovation Laboratory. He has worked on dedicated processor to quantum-computing simulation, CMOS-integrated DNA chips, FinFET technology and circuits, and AI accelerator.
Dr. O’uchi is a member of the IEEE Solid-State Circuits Society and Electron Device Society, the Institute of Electronics, Information and Communication Engineers (IEICE).

Session 2: Materials Science and Technology

Metallic delafossites for low-resistivity advanced interconnects

Takayuki Harada
Principal researcher

National Institute for Materials Science (NIMS), Japan

Biography

He received a Ph.D. degree in applied chemistry from the University of Tokyo (2011). Prior to joining NIMS, he worked at Institute for Solid State Physics in UTokyo, Max Planck Institute for Solid State Research, and Institute for Materials Research in Tohoku University. He is focusing on exploratory research on thin-film heterostructures. He has published about 40 peer-reviewed papers and holds 2 patents. Recent honors include the MEXT Prize for Young Scientists.

Session 7: Advanced Packaging Ⅱ

Development of a test platform to evaluate process variables for copper hybrid bonding technology

Kyung-Ho Park
Principal researcher

Korea Advanced Nano Fab Center (KANC), Korea

Biography

Kyung-Ho Park is a principal researcher at Korea Advanced Nano Fab Center (KANC), where he leads the advanced packaging TF.
He received a Ph. D. in applied physics from Ajou University in Korea (2002).
Prior to joining the advanced packaging TF, he worked at the convergence technology division as a general manager (vice president).
His research interests include semiconductor advanced packaging technologies such as Cu hybrid bonding, silicon bridge, and RDL (Redistribution Layer).
He has published 81 peer-reviewed articles and holds 43 patents. Recent honors include a commendation from the Minister of Science and ICT of the Republic of Korea.