Advanced Metallization Conference 2024
33rd Asian Session

About ADMETA Plus

Advanced Metallization Conference 2024
33rd Asian Session
Oct. 2-4, 2024, Hybrid Conference (on site & online)

Oct.2: Tutorial (Japanese)
Oct.3-4 : Conference

Sponsored by
The Japan Society of Applied Physics

The ADMETA Plus is heading for the 33rd annual meeting and has a long history of important contributions to state-of-the-art interconnect progress for advanced logic and memory devices. In recent years, the importance of interconnect technology for realizing low resistance, large integration, low cost, high reliability, and 3D-ICs is increasing more and
more in various device applications.

This conference focuses on interconnects technology related to materials, processes, device, circuit design, assembly, equipment, and characterization. We will conduct comprehensive discussions widely from basics to applications with researchers and engineers from industry, government, and academia. We are looking forward to new developments in interconnect technology fields and contributing to the growth of semiconductor industry.

The ADMETA Plus 2024 Theme is “Interconnection from material to VLSI system for a Sustainable Development.” Based on the conference theme, I plan to have appealing contents, including tutorial (Japanese only), plenary talks, invited talks and poster session.

I would like you and your colleagues to submit the contributed papers in wide range of aspects in interconnects area. I am looking forward to seeing you in Tokyo.

ADMETAPlus 2024 General Chair: Mayumi B. Takeyama (Kitami Institute of Technology)