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Advanced Metallization Conference 2019
29th Asian Session

Advanced Metallization Conference 2019: 29th Asian Session
Oct. 9-11, 2019,
Sanjyo Conference Hall,
The University of Tokyo, Tokyo

Oct. 9: Tutorial
Oct. 10-11 : Conference

Sponsored by
ADMETA Committee

Co-sponsored by
The Japan Society of Applied Physics

Supported by
The Institute of Electronics, Information and Communication Engineers
The Japan Institute of Metals
The Surface Finishing Society of Japan
The Japan Society of Vacuum and Surface Science
The Institute of Electrical Engineers of Japan
The Japan Society for Precision Engineering
IEEE EDS Japan Chapter
The Japan Institute of Electronics Packaging

Subsidized by
The Murata Science Foundation

The ADMETAPlus is heading for its 29th historical meeting and has a long record of important contributions to practical progress for advanced MPU and various memory devices. In recent years, the importance of interconnect technology for realizing low resistance, large integration, rich functionality, low cost, and high reliability has increased in various device application fields beyond silicon electronics. This conference will focus on interconnects technology and science related to materials, processes, device design, assembly, equipment, cost performance, and characterization. We will host comprehensive discussions on a wide range of topics, establish basics to applications, with researchers and engineers from industry, government, and academia. We are looking forward to new developments in interconnect technology fields and contributing to the growth of semiconductor industry in the Asian area.

ADMETAPlus 2019 General Chair, Shinji Yokogawa (The University of Electro-Communications)

Notation based on the Specified Commercial Transaction Act 

(C) ADMETA Plus 2019 all rights reserved.