Keynote Speakers
- Dr. Seok-Hee Lee (ADMETA Co-Chair / SK Hynix Inc.)
- Dr. Satoshi Tanimoto (Nissan Arc.)
Invited Speakers
- Dr. Young-Joon Park (Texas Instruments Inc.)
- Dr. Tae-Kyu Lee (Cisco Systems Inc.)
- Prof. Xin-Ping Qu (Fudan University) - Novel Alloy Diffusion Barrier for Advanced Copper Interconnect
- Prof. Chee Lip Gan (Nanyang Technological University) - Copper Nanoparticles Enabled Low Temperature Bonded Interconnections
- Dr. Manabu Tsujimura (CTO, Ebara Corporation) - The Way to Zero’s –The future of Semiconductor Device and CMP Technologies
- Dr. Sintaro Sato (Fujitsu Laboratories Ltd.) - Nanocarbon Interconnects
with Resistivity and Reliability Better than Cu
- Prof. Hyungjun Kim (Yonsei University)
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