Download CFP（PDF)
Abstracts submission by: June 20 >> July 4 >> July 18, 2015
Notification of acceptance: In July
Authors submit abstracts to: ADMETA 2015 : 25th Asian Session Office E-mail: admeta2015@gmail.com
Abstract format:
• A two-page abstract (PDF file) with all figures and tables is required.
• A template of abstract can be downloaded from sample.pdf, sample.doc.
• The corresponding author should be indicated with mailing and e-mail
addresses.
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"The due date of ADMETA plus 2015 abstract submission has been extended
to July 4, 2015."
We cordially invite you to submit an abstract to the ADMETA plus 2015 to
be held on September 16-18 2015 in Seoul National University, Seoul, Korea.
The topics of ADMETA plus 2015 include (but are not limited to): Advanced
Interconnects, Materials and Unit Processes, 3D Integration & Packaging,
Interconnect technologies for Display, Emerging Interconnect Technology,
Design for Reliability and Failure Analysis, Modeling and Simulation of
Advanced Metallization and IC thermal Management.
Join us at this major event in beautiful Seoul.
Organizing Committee
ADMETA plus 2015
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