The 25th Asian Session of Advanced Metallization Conference (ADMETA) will
be held at the Global Convention Plaza, Seoul National University, Seoul,
Korea during September 16–18, 2015.
ADMETA is devoted to leading-edge research in the field of advanced interconnect
and electronic packaging in materials, processing, design, simulation,
and reliability. This premier conference will also provide an excellent
opportunity for researchers, engineers, and students to discuss recent
advances and new research directions.
The conference will feature several technical sessions (oral presentations
and posters), five tutorial sessions, plenary sessions (keynote speeches),
and exhibitions. The tutorials offer introductory overview and state-of-the-art
technology reviews in a condensed format. Special posters presented at
the ADMETA will be awarded the Best Poster Awards.
The conference seeks papers on all aspects of interconnects for device,
circuit board and system-level applications. The deadline for submission
of abstracts is June 20, 2015. The organizing committee eagerly awaits
your participation in ADMETA 2015 and look forward to welcoming you in
Seoul, Korea
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