About ADMETAPlus 2015
 Important Dates
 Call for Papers
  Full length paper submission
 Invited and Keynote Speakers
 Conference Program
 Oral Presentation
 Poster Presentation
 Top Page

The 25th Asian Session of Advanced Metallization Conference (ADMETA) will be held at the Global Convention Plaza, Seoul National University, Seoul, Korea during September 16–18, 2015.

ADMETA is devoted to leading-edge research in the field of advanced interconnect and electronic packaging in materials, processing, design, simulation, and reliability. This premier conference will also provide an excellent opportunity for researchers, engineers, and students to discuss recent advances and new research directions.

The conference will feature several technical sessions (oral presentations and posters), five tutorial sessions, plenary sessions (keynote speeches), and exhibitions. The tutorials offer introductory overview and state-of-the-art technology reviews in a condensed format. Special posters presented at the ADMETA will be awarded the Best Poster Awards.

The conference seeks papers on all aspects of interconnects for device, circuit board and system-level applications. The deadline for submission of abstracts is June 20, 2015. The organizing committee eagerly awaits your participation in ADMETA 2015 and look forward to welcoming you in Seoul, Korea


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