Conference Topics of Interest

Integration: Structure, Performance, Resistance, Capacitance, Evaluation, Analysis, etc.

Reliability Science and Failure Analysis: EM, SIV, TDDB, Measurement, Evaluation, Defect Inspection, Yield Improvement, Process Dispersion Modeling, etc.

Metallization: PVD, CVD, ALD, ECD, Barrier Metal, Nucleation Layer, Seed Layer, Alloy, Supercritical, New Materials, etc.

Low-k Dielectric: CVD, ALD, SOD, Porous Films, New Materials, Adhesion, Interface Reaction, Air Gap, Evaluation, etc.

Contact: Silicide, Interface, Solid Phase Reaction, Shallow Junction, Crystal Properties, Electron Properties, Carrier Transport, Parasitic Resistance, etc.

CMP:  Planarization Technology, Slurry, Pad, Dress, End Point Detection, Cleaning, Anti-corrosive Technology, etc.

MEMS/RF: Structure, Materials, Packaging, Deposition Tech., Etching Tech., CMP, Electroplating, Switch, Inductor, Varactor, Resonator, Transmission Line, etc.

Emerging Technology: Active Wiring, Memristor, Sensor, Electronic Luminescence, Silicon Photonics, Power Electronics, Flexible Electronics, Energy Harvesting, etc.

Organized-Session Topics of Interest

3D Challanges Session: COW, WOW, Thinning, Bonding, TSV, Bump, Individuating, Redistribution Layer, Cooling, Reliability, etc.

Nanocarbon Session: Graphene, Carbon Nanotube, Deposition, Growth, Integration, Electrical Characteristics, Reliability, Evaluation, Analysis, Doping, etc.

Backend Device Technologies Session: Tech. for Embedding Devices (MRAM, PCRAM, ReRAM, DRAM etc.), Science and Process of Magnetic, Phase-Change and Resistive-Change Devices, Electrode, Metallization, etc.

CMP Session:  Planarization Technology, Slurry, Pad, Dress, End Point Detection, Cleaning, Anti-corrosive Technology, etc.