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Advanced Metallization Conference 2013: 23rd Asian Session
Oct. 7-10, 2013,
Hongo Campus, The University of Tokyo, Tokyo

Oct. 7: Tutorial
Oct. 8-10 : Conference

Sponsored by
The Japan Society of Applied Physics

Supported by
The Surface Finishing Society of Japan,
The Institute of Electrical Engineers of Japan,
The Japan Society for Precision Engineering,
The Institute of Electronics, Information and Communication Engineers,
The Japan Institute of Metals and Materials,
The Vacuum Society of Japan,
The Surface Science Society of Japan.

Dear Colleagues

Advanced Metallization Conference 2013, 23rd Asian Session (ADMETAPlus 2013) will be held from October 7 through 10, 2013. The conference is organized to stimulate and enhance the research and development of ULSI interconnect technology. In every year since 1989, the conference has been held at about the same time in both Japan (ADMETA) and USA (AMC), and ADMETA has showcased remarkable interconnect technology development in Asia.

Current active development of Cu multilayer wiring technology is aimed at feature sizes of less than 50nm, and application of Cu wiring has been broadened to be widely used for Flash and DRAM. Securing good reliability for electromigration and low-k films in cutting-edge low-k/Cu wiring schemes is an important area of interest. There have been advancements in the introduction of metal deposition for front end processes such as for silicides and metal gates, and this area is also covered by ADMETA. The progress of miniaturization technology for packaging is rapid, and concepts for integrated wiring technology between Si chips and mounting substrates are required. 3D wiring technology is currently paid special attention as an important direction for further device integration. Contributions of papers addressing these topics are being highly solicited as well as papers in related areas such as interconnect materials, interconnect design, reliability, process equipment, and cost reduction, etc. where there is no shortage of problems to be solved.

In addition to the main conference with its emphasis on the direction of conventional wiring scaling, four Organized Sessions (Backend Device Technologies, Nanocarbon, 3D Challenges, CMP), will be held to discuss post-scaling technologies that are either under development or in concept stage.

This conference offers an excellent opportunity to learn about the most recent R&D activities in interconnect technology and related fields from researchers around the world. We look forward to your attendance.

ADMETAPlus 2013 General Chair:
Junichi Koike (Tohoku University)

ADMETAPlus 2013 Program Chair:
Fuminori Ito (Toshiba)

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