ADMETA 2025
Advanced Metallization Conference 2025
Invited Speakers
Plenary Talk 1: Introducing a New Transistor Architecture to Enable Scaling beyond Nanosheet Devices
Huiming Bu (IBM Research)
Plenary Talk 2: Interconnect Innovations Leading the way for the Leading Edge
Christopher J. Wilson (imec)
Plenary Talk 3: Metallization Processes for Angstrom Scale Interconnects
Robert D. Clark (Tokyo Electron Limited)
Invited Talk 1: Paradigm Revolution 2030- Beyond Cliff, Ahead New Paradigm
Manabu Tsujimura (Ebara Corporation)
Invited Talk 2: Metallic Interfaces of 2D Semiconductor Materials and Devices
Won-Jong Yoo (Sungkyunkwan Univeristy)
Invited Talk 3: Wet Cleaning Technology for Advanced Semiconductor Device
Masanobu Sato (SCREEN Semiconductor Solutions Co., Ltd.)
Invited Talk 4: Advanced Plasma Etching Technologies for Leading-edge Device Fabrication
Michikazu Morimoto (Hitachi High-Tech Corporation)
Invited Talk 5: Area-Selective Atomic Layer Deposition through Locally Activated and Deactivated Approaches for Bottom-Up Nanopatterning
Woo-Hee Kim (Hanyang University)
Invited Talk 6: Scaling in the Future: Atomic Layer Deposition of Metals for Next Generation of Device
Chiyu Zhu (ASM)
Invited Talk 7: Degradation Mechanisms and Reliability Enhancement of Copper Interconnects
Kazuyoshi Ueno and Fumihiro Inoue (Yokohama National University)
Invited Talk 8: A novel BEOL Ru interconnect beyond Cu era
Seongho Park (imec)
Invited Talk 9: Wafer bonding W2W Bonding Process Challenges for High Volume Manufacturing
Yoshihiro Kondo (Tokyo Electron Kyushu Limited)
Invited Talk 10: Enabling High Density Packaging with Digital Lithography
Niranjan Khasgiwale (Applied Materials Inc.)
