Advanced Metallization Conference 2023
32nd Asian Session
2023年10月12日（木）～ 13日（金） 本会議
公益社団法人 応用物理学会 シリコンテクノロジー分科会
The ADMETA Plusis heading for the 32nd annual meeting and has a long history of important contributions to state-of-the-art interconnect progress for advanced logic and memory devices. In recent years, the importance of interconnect technology for realizing low resistance, large integration, low cost, high reliability, and 3D-ICs is increasing more and more in various device applications.
This conference focuses on interconnects technology related to materials, processes, device, circuit design, assembly, equipment, and characterization. We will conduct comprehensive discussions widely from basics to applications with researchers and engineers from industry, government, and academia. We are looking forward to new developments in interconnect technology fields and contributing to the growth of semiconductor industry.
The ADMETA Plus 2023 Theme is “Interconnection from material to VLSI system for a Sustainable Development.” Based on the conference theme, I plan to have appealing contents, including tutorial (Japanese only), plenary talks, invited talks and poster session. I would like you and your colleagues to submit the contributed papers in wide range of aspects in interconnects area. I am looking forward to seeing you in Tokyo.