On the day preceding the conference, a short course summarizing the current status of advanced ULSI metallization and interconnects will be presented, utilizing the collective wisdom of several leaders in the field.

Tutorial Program

October 9

10:00-10:50　Metallization
                     Koichi Motoyama (IBM Research)

10:50-11:40　3D Flash Memory
                     Masayoshi Tagami (KIOXIA)

11:40-12:30    ALD
                     Fumiaki Hayase (Tokyo Electron Technology Solutions)

13:30-14:20    Semiconductor Market Trend
                     Hiroshi Kuwatsuka (Deloitte Tohmatsu Financial Advisory)

14:20-15:10　 Interconnect Conference Trend
                      Kazuyoshi Ueno (Shibaura Institute of Technology)

15:10-16:00　 Lithography
                      Satoshi Tanaka (KIOXIA)

16:20-17:10     CMP
                      Kazumi Sugai (Fujimi Incorporated)

17:10-18:00　  3D CMOS image sensor
                       Hayato Iwamoto (Sony Semiconductor Solutions)

*Official language of the short course is Japanese.
*Titles are tentative.