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Advanced Metallization Conference 2019
29th Asian Session
 Tutorial

 

On the day preceding the conference, a short course summarizing the current status of advanced ULSI metallization and interconnects will be presented, utilizing the collective wisdom of several leaders in the field.

Tutorial Program

October 9

10:00-10:50 Metallization
                     Koichi Motoyama (IBM Research)


10:50-11:40
 3D Flash Memory
                     Masayoshi Tagami (Toshiba Memory)


11:40-12:30    ALD
                     
Fumiaki Hayase (Tokyo Electron Technology Solutions)


13:30-14:20    Semiconductor Market Trend
                     Hiroshi Kuwatsuka (Deloitte Tohmatsu Financial Advisory)


14:20-15:10
  Interconnect Conference Trend
                      Kazuyoshi Ueno (Shibaura Institute of Technology)


15:10-16:00
  Lithography
                      Satoshi Tanaka (Toshiba Memory


16:20-17:10     CMP
                      Kazumi Sugai (Fujimi Incorporated)


17:10-18:00
   3D CMOS image sensor
                       Hayato Iwamoto
(Sony Semiconductor Solutions)

*Official language of the short course is Japanese.
*Titles are tentative.

 
 

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