Structure and Performance, Parasitic Capacitance, Reliability Technology,
Testing and Analysis
Science and Failure Analysis: EM, SIV, TDDB, Defect Detection
and Analysis, Failure Mechanism and Modeling
CVD, ALD, Plating, Barrier Metal, New Material, Alloy, Supercritical Fluid, Reflow
Dielectric: CVD, ALD, SOD, Film Properties, New Materials,
Dielectric Structures (Air Gap), Metrology, etc.
Planarization Technology, Slurry, Pad, Dress, End Point Detection, Cleaning, Anti-corrosive
Silicide, Interface, Solid Phase Reaction,
Shallow Junction, Crystal Properties, Electron Properties, Carrier Transport,
Structure and Materials, Packaging, Fabrication Process Technology, Device
Technology: Active Wiring, Power Electronics, Silicon Photonics,
Flexible Electronics, Energy Harvesting, etc.
Device Technology: Tech. for Embedding Devices (MRAM, PCRAM,
ReRAM, DRAM etc.), Materials and Processing of Magnetics, Phase-Change and Resistive-Change
Devices, Electrode, Metallization, etc.
Graphene, Carbon Nanotube, Deposition, Integration, Electrical Characteristics,
Reliability, Evaluation, Analysis, etc.
and Packaging: TSV, TMV, Stacking Method (CoW, WoW), Thinning, Planarization,
Bonding, Bump, Stress and Thermal Analysis, Sealing, Cooling, Reliability.