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Advanced Metallization Conference 2018
28th Asian Session
 Tutorial
Oct.10th, 2018

9:00-9:10
Opening remarks

Xun Gu, Tutorial Chair (SanDisk Limited)

9:10-10:00
From low cost manufacturer to worldwide partner --Repositioning Chinese IC Industry
Tian-chun Ye (President of Institute of Microelectronics, Chinese Academy of Science)

10:00-10:50
Black Diamond --Low-k to Ultralow-k and Beyond

Kang Sub Yim (Distinguished Member of Technical Staff, Applied Materials, USA)

10:50-11:20
Break Time

11:20-12:10
Introduction to plasma etching of porous low-k films

Maxime Darnon (Researcher/adjunct professor, CNRS/Universite de Sherbrooke, Canada)

12:10-13:30
Lunch

13:30-14:20
Challenges & Requirements of BEOL Integration in sub-10nm

Hyung Woo Kim (Senior Manager/Deputy Director, GLOBALFOUNDRIES, USA)

14:20-15:10
Semiconductor Wet Cleaning, CMP, and Contamination Control in Wet Process

Hitoshi Morinaga (Senior General Manager, FUJIMI Incorporated, Japan)

15:10-15:40
Break Time

15:40-16:30
Backed-end-of-line Reliability: Metal migration and low-k breakdown

Yunlong Li (Senior R&D Engineer, imec, Belgium)

16:30-17:20
3D Integration for Advanced Packaging

Kuan-Neng Chen (Professor/IEEE Fellow, National Chiao Tung University)

18:00-19:30
Dinner Banquet


 
 

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