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Advanced Metallization Conference 2018
28th Asian Session
 Conference Invited Speakers

Conference Keynote Speaker:
Dr. Ruth A. Brain
Intel Fellow, Technology and Manufacturing Group Director, Interconnect Technology and Integration
Intel Corporation, USA
Ruth A. Brain is an Intel Fellow in the Technology and Manufacturing Group and the director of interconnect technology and integration at Intel Corporation. She leads the integration group responsible for defining key interconnect features of 7-nanometer(7nm) process technology, the high-performance Intel logic technology currently in research. Among her recent accomplishments, Brain delivered Intel’s 32nm device technology to production, a milestone that introduced self-aligned vias to high-volume manufacturing. She also led the team that developed Intel’s pioneering 22nm DRAM process.
Brain holds a bachelor’s degree in physics and mathematics from lowa State University and earned her master’s degree and Ph.D. in physics from the California Institute of Technology.
She has been issued more than 10 U.S. patents in the area of interconnect processes and integration, with additional patents pending, and has authored or co-authored more than a dozen papers in her field of expertise. She served as the 2015-16 North American program chair for the international Interconnect Technology Conference. Brain was appointed as intelFellowin2016.
   * Dr. Meisheng Zhou*
 Executive Vice President
 Technology Research and Development
 * Semiconductor Manufacturing International Corporation, China*
 Dr. Meisheng Zhou, is an Executive Vice President of Technology Research and Development in Semiconductor Manufacturing International Corporation (SMIC) since 2017. Dr. Zhou is one professional of the “National Recruitment Program of Global Experts (abbreviation of the overseas high-level talent introduction plan). Before she joined the company, she has ever conducted various levels of management positions in Chartered Semiconductor Manufacturing, TSMC, UMC, Global Foundries and Lam Research.

Dr. Zhou received BSc and MSc degrees from Fudan University China in 1982 & 1985 respectively, and Ph.D. degree in Chemistry from Princeton University in 1990. Equipped with more than 20 years’ experience in world’s leading foundry companies, Dr. Zhou has accumulated extensive and rich management experience in advanced technology R&D, technical cooperation, technology transfer, verification of mass production, the start-up operation/mass production/operation of 12” Fab, and gradually shaped her own distinctive management philosophy. Specialized in module device, process and integrated technology, Dr. Zhou has been awarded with more than 130 US patents and published over 40 papers as co-inventor/author.

Conference Invited Speaker:

1. Prof. Larry Zhao, Technical Director, Lam Research, USA
 Overview of AMC/IITC 2018

2. Dr. Kang Sub Yim, Distinguished Member of Technical Staff, Applied Materials, USA
 BEOL Low-k Dielectrics for 7nm and below

3. Prof. Mansun Chan, The Hong Kong University of Science and Technology
 Carbon Enhanced BEOL Technology

4. Prof. Chih Chen, National Chiao Tung University
 Fabrication of (111) nanotwinned Cu and its applications in Cu direct bonding and Cu redistribution lines in 3D IC integration

5. Prof. Maxime Darnon, CNRS / Université de Sherbrooke , Canada
 Interaction of humidity with plasma-damaged porous low-k

6. Prof. Z.D. Kvon, Institute of Semiconductor Physics, Novosibirsk State University, Russia
 Topological insulators: myths and reality

7. Prof. Junichi Koike, Tohoku University, Japan
 Co-Ti alloy for BEOL and MOL metallization for advanced technology node

8. Prof. Xia Xiao, Tianjin University
 Evaluation of film adhesion by using surface acoustic waves

9. Dr. Hyung Woo Kim, Senior Manager/Deputy Director, GLOBALFOUNDRIES, USA
 BEOL integration Challenges beyond 7nm

10. Dr. David Thompson, Director, Applied Materials, USA
 (Tentative) Selective deposition

11. Dr. Yunlong Li, Senior Engineer, imec, Belgium
 Dielectric Reliability of Highly Scaled Through Silicon Via for Wafer Level 3D-SoC Applications

12. Dr. Ruth Shima Edelstein, Manager, TowerJazz Semiconductors, Israel
 Integration challenges of AlGaN/GaN based devices in a CMOS Foundry

13. Prof. Kuan-Neng Chen, National Chiao Tung University
 Low Temperature Bonding Technology for Advanced Packaging and 3D Integration

14. Dr. Yuchun Wang, Anji Microelectronics
 CMP Slurry Innovation for Metallization at Different Dimensions and Device Stacking

15. Dr. Qianru Zhou, Beijing NAURA Microelectronics Equipment Co.,Ltd
 Study on the AlOx film using pulsed magnetron sputtering


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