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Advanced Metallization Conference 2017
27th Asian Session

Advanced Metallization Conference 2017: 27th Asian Session
Oct. 18-20, 2017,
Hongo Campus, The University of Tokyo, Tokyo

Oct. 18: Tutorial
Oct. 19-20 : Conference

Sponsored by
ADMETA Committee

Co-sponsored by
The Japan Society of Applied Physics

Supported by
The Surface Finishing Society of Japan,
The Institute of Electrical Engineers of Japan,
The Japan Society for Precision Engineering,
The Institute of Electronics, Information and Communication Engineers,
The Japan Institute of Metals and Materials,
The Vacuum Society of Japan,
The Surface Science Society of Japan.
The Japan Institute of Electronics Packaging
IEEE EDS Japan Chapter

The ADMETAPlus has been heading for the 27th historical meeting and long contributed to practical progress for advanced MPU and various memory devices. In recent years, the importance of interconnect technology for realizing low resistance, large integration, rich function, low cost, and high reliability is increasing more and more in various device application fields beyond silicon electronics. This conference is focusing interconnects technology and science related to materials, processes, device design, assembly, equipment, cost performance, and characterization. We will conduct comprehensive discussions widely from basics to applications with researchers and engineers from industry, government, and academia. We are looking forward to newly developing interconnect technology fields and also contributing the growth of semiconductor industry in the Asian area.

ADMETAPlus 2017 General Chair:
Osamu Nakatsuka (Nagoya University)

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