On the day preceding the conference, a short
course summarizing the
current status of
advanced ULSI metallization
and interconnects
will be presented, utilizing
the collective
wisdom of several leaders
in the field.
*Official language of the
short course is
Japanese, and presentation
and discussion
will be made by Japanese.
Tutorial Program
1) Cu/Low-k Integration, Atsunobu Isobayashi (Toshiba)
2) CMP, Seiichi Kondo (Hitachi Chemical)
3) Reliability, Shinji Yokogawa (Renesas Electronics)
4) Metal, Yasushi Higuchi (ULVAC)
5) Patent, Yoichi Oshima (Japan Patent Office)
6) Plasma, Masaru Hori (Nagoya University)
7) Graphene, Masao Nagase (Tokushima University)
8) MRAM, Tetsuhiro Suzuki (Renesas Electronics)
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