Advanced Metallization Conference 2012: 22nd Asian Session
Oct. 22-25, 2012,
Hongo Campus, The University of Tokyo, Tokyo
Oct. 22: Tutorial
Oct. 23-25 : Conference
Sponsored by
The Japan Society of Applied
Physics
Supported by
The Surface Finishing Society of Japan,
The Institute of Electrical Engineers
of
Japan,
The Japan Society for Precision Engineering,
The Institute of Electronics, Information
and Communication Engineers,
The Japan Institute of Metals,
IEEE EDS Japan Chapter,
The Vacuum Society of Japan,
The Surface Science Society of
Japan.
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Dear Colleagues
Advanced Metallization Conference 2012, 22nd Asian Session (ADMETAPlus 2012) will be held from October 22 through
25, 2012. The conference is organized to
stimulate and enhance the research and development
of ULSI interconnect technology. In every
year since 1989, the conference has been
held at about the same time in both Japan
(ADMETA) and USA (AMC), and has showcased
remarkable interconnect technology development
in Asia.
Current active development of Cu multilayer
wiring technology is aimed at feature sizes
of less than 50nm, and application of Cu
wiring has been broadened to the memory market
and is widely used for Flash and DRAM. Securing
good reliability for electromigration and
low-k films in Low-k/Cu wiring schemes is
still an important area of interest. There
have been advancements in the introduction
of metal deposition for front end processes
such as for Silicide and Metal Gate, and
submissions in this area are welcome. The
progress of miniaturization technology for
packaging is rapid, and concepts for integrated
wiring technology between Si chips and mounting
substrates are required. 3D wiring technology
will be paid special attention as an important
direction for further device integration.
Contributions of papers addressing these
topics are being highly solicited as well
as papers in related areas such as interconnect
materials, interconnect design, reliability,
process equipment, and cost reduction, etc.
where there is no shortage of problems to
be solved.
In addition to the main conference with its
emphasis on the direction of conventional
wiring scaling, three Organized Sessions
(Backend Devices, CMP, Nanocarbon Interconnects)
will be held to discuss post-scaling technology
that is either in development or in concept
stage.
This conference offers an excellent opportunity
to learn about the most recent R&D activities
in interconnect technology and related fields
from researchers around the world. We look
forward to your attendance.
ADMETAPlus 2012 General Chair:
Hisao Kawasaki (Mitsubishi Heavy Industries)
ADMETAPlus 2012 Program Chair:
Eiichi Kondo (Yamanashi University)
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