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Advanced Metallization Conference 2011: 21st Asian Session
Sep. 12-15, 2011,
Toyosu Campus, Shibaura Institute of Technology, Tokyo

Sep. 12: Tutorial
Sep. 13-15 : Conference
(MtM Seission : Sep. 15)

Sponsored by
The Japan Society of Applied Physics

Supported by
the Surface Finishing Society of Japan,
The Institute of Electrical Engineers of Japan,
The Japan Society for Precision Engineering, the Institute of Electronics,
Information and Communication Engineers,
the Japan Institute of Metals,
IEEE EDS Japan Chapter,
the Vacuum Society of Japan,
The Surface Science Society of Japan.

Dear Sir/Madam,

Advanced Metallization Conference 2011, 21st Asian Session: ADMETAPlus 2011 will be held from September 12 to 15, 2011. The conference is organized to stimulate and enhance the research and development of ULSI interconnect technology; and each year since 1989 the conference has been held at about the same time in both Japan and USA, and has showcased remarkable interconnect technology development in Asia.

Current active development of Cu multilayer wiring technology is aimed at feature sizes of less than 50nm. The application of Cu wiring has also been broadened to the memory market and is widely used for Flash and DRAM. However, securing good reliability on electro-migration and low-k films in Low-k/Cu wiring schemes is still an important topic. Moreover, there is advancement in the introduction of metal deposition for transistor surroundings such as for Silicide and Metal Gate, etc. The progress of miniaturization technology for packaging is rapid, and concepts for integrated wiring technology between Si chips and mounting substrates are requested. Especially, the 3D wiring technology is paid to attention as one of the directionality in the future. Contributions of papers are highly solicited addressing these topics, and related areas such as materials, interconnect design, reliability, equipment, and cost reduction, etc. where there is no shortage of problems to be solved. On this conference, the organizer system of each session is introduced for more attractive program planning.

In addition to the main conference, " MtM (More than Moore) special session" will be held to discuss More than Moore technology in which the proposal and development are actively performed as the post-scaling technology.

This conference offers an excellent opportunity to learn about the most recent R&D activities in interconnect metal technology and related fields from around the world. Now is the time for you to join us.

ADMETAPlus 2011 Chairman:
Kazuyoshi Ueno (Shibaura Institute of Technology)

ADMETAPlus 2011 Program Chairman:
Jun-ichi Koike (Tohoku University)


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