On the day preceding the conference, a short
course summarizing the current status of
advanced ULSI metallization and interconnects
will be presented, utilizing the collective
wisdom of several leaders in the field.
Official language of the short course is
Japanese, and presentation and discussion
will be made by Japanese.
Tutorial Program
1) Cu/Low-k & Integration，Takeshi Furusawa（Renesas）
2) Cu Electroplating，Nobuki Hosoi（Selete）
3) Dry Etching，Keizo Kinoshita（NEC）
4) Cu Metallization & New Materials，Jun-ichi Koike（Tohoku Univ.）
5) Packaging, Eiji Hagimoto（eEichi Criates）
＊Speaker Change:Yoshimasa
Ono（The Univ.
of Tokyo） ⇒ Eiji Hagimoto（eEichi
Criates）
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