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Conference Topics of Interest
Integration: Structure, Performance, Resistance, Capacitance,
Evaluation, Analysis, etc.
Reliability Science and Failure Analysis:
EM, SIV, TDDB, Measurement, Evaluation, Defect Inspection,
Yield Improvement, Process Variation Modeling, etc.
Metallization: PVD, CVD, ALD, ECD, Barrier Metal, Nucleation Layer, Seed
Layer, Alloy, Supercritical, New Materials,
etc.
Low-k Dielectric: CVD, ALD, SOD, Porous Films, New Materials,
Adhesion, Interface Reaction, Air Gap, Evaluation, etc.
CMP: Planarization Technology, Slurry, Pad, Dress,
End Point Detection, Cleaning, Anti-Corrosive
Technology, etc.
Contact: Silicide, Interface, Solid Phase Reaction,
Shallow Junction, Crystal
Properties, Electron
Properties, Carrier Transport,
Parasitic
Resistance, etc.
MEMS/RF: Structure, Materials, Packaging, Deposition
Tech., Etching Tech., CMP, Electroplating, Switch, Inductor, Varactor,
Resonator, Transmission Line, etc.
Emerging Technology: Active Wiring, Memristor, Sensor, Electronic
Luminescence, Silicon Photonics,
Power Electronics,
Flexible Electronics, Energy
Harvesting,
etc.
Organized-Session Topics of Interest
Backend Device Technologies Session: Tech. for Embedding Devices (MRAM, PCRAM,
ReRAM, DRAM etc.), Science
and Process of
Magnetic, Phase-Change
and Resistive-Change
Devices, Electrode, Metallization,
etc.
Nanocarbon Session: Graphene, Carbon Nanotube, Deposition, Growth,
Integration, Electrical
Characteristics,
Reliability, Evaluation,
Analysis, Doping,
etc.
Joint-Session (with IWAPS) Topics of Interest
3D and Packaging Session: TSV (Etching, CVD, PVD, Plating, CMP, etc.),
Stacking Technologies (COW, WOW), Thinning,
Planarizaiton, Flattening, Bonding, TMV, Bump, Stress Analysis, Thermal Management,
Individuating, Redistribution Layer, Sealing,
Cooling, Reliability, Test and Inspection,
etc.
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