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 Tutorial

On the day preceding the conference, a short course summarizing the current status of advanced ULSI metallization and interconnects will be presented, utilizing the collective wisdom of several leaders in the field.

Official language of the short course is Japanese, and presentation and discussion will be made by Japanese.

Tutorial Program
1)  Cu/Low-k & Integration, Shunichi Fukuyama (Fujitsu Semiconductor)
2)  Low-k, Tatsuya Usami (Renesas Electronics)
3)  Dry etching, Hisataka Hayashi  (Toshiba
4)  Market Tred, Wtaru Izumiya (The Semiconductor Industry News
5)  Metal, Kazuhiro Ito (Kyoto University)
6)  CMP, Hiroyuki Chibahara (Renesas Electronics)
7)  Carbon Nano Tube, Tadashi Sakai (Toshiba)
8)  Packaging, Hiroshi Okazaki (NTT DOCOMO)














 
 

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