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 About ADMETA2009
 Important Dates
 Call for Papers
 Special issu of JJAP
 Invited Speaker
 Conference Program
 Oral Presentation
 Poster Presentation
 Top Page

 Conference Topics of Interests

 Metal CVD, ALD, PVD, Electroplating, Barrier Metal Films, Selective Deposition Technology, etc.

Interconnect & Dielectric Materials:
 Interconnect, Carbon Nanotube Wires, Contacts, Diffusion Barriers, Low-k, High-k, etc.

Materials Science of Thin Films, Surfaces and Interfaces:
 Thin Film Properties, Grain Properties, Surface and Interface Structure and Reaction, Diffusion Properties, etc

Reliability Science and Failure Analysis (linked with the Special Session):
 Reliability Engineering, EM Evaluation, SIV Evaluation, Measurement Evaluation Technology, Defect Inspection, Yield Improvement, etc.

Planarization Technology:
 CMP, Pad/Slurry Technology, End Point Detection, New Planarization Technology, etc

Deposition Technology:
 New CVD Methods, ALD, PVD, Electroplating, Selective Deposition, High Temperature Deposition / Reflow, High Pressure Filling, etc.

Processing Science and Modeling:
 Deposition and Etching from Gases, Liquids and Solids, Process Modeling, etc.

 Porosimetry, Film Strength, Film Density, Film Adhesion Measurement, etc.

Process Integration Issues:
 Metal Gate, Silicide/Salicide, ILD Deposition and Planarization, Surface Cleaning/Treatments, Metal/Dielectric Etching, Barrier/Cu Interconnect Formation, Low-k Technologies.

Advanced Structures and Scaling Issues:
 DRAM, Flash, Automotive Device Interconnects, Printed Substrate Wiring, Interconnect Design, Interconnect Modeling, New Interconnect Construction Technologies, Airgap, Inductive Coupling, Wireless, etc.

System in a Package:
 Packaging/Mounting Technology, Bump Technology, Wafer Bonding, 3-D Stacked Chip Technology, etc.

(C) ADMETA2008 all rights reserved.