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+ Conference Topics of Interests +
Processing Science and Modeling：
Thin film formation from gases/liquids/solids,
etching, process modeling
Materials Science of Thin Films, Surfaces
and Interfaces：
condensed matter physics of thin films,
reaction at grain boundaries/
interfaces
Interconnect and Dielectric Materials：
Interconnects, barriers, contacts, Low-k,
High-k, metal gates
Deposition Technology：
CVD, ALD, PVD, ECD, Selective deposition,
reflow, high-pressure processes
Characterization：
Porosimetries, adhesion assessment
Planarization Technology：
CMP, Pads/Slurries, end-point detection,
process modeling, novel technologies
Process Integration Issues：
Silicides/Salicides, ILD deposition and plaranization,
surface cleaning/treatments
Metal/dielectric etching, barrier/Cu interconnect
formation, low-k technologies
Advanced Structures and Scaling Issues：
design and modeling, new interconnect structures,
air-gap, inductors
System in a Package：
Packaging/Jisso techs, bump formation, wafer
bonding
Reliability Science and Failure Analysis：
metrology, defect analysis, yield management,
reliability science
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