The ADMETA conference will include all fundamental and applied sciences and technologies in the field of traditional interconnects, emerging interconnects, 3D interconnects, and their related materials and processes. Topics may include from, but are not limited to, the following area:
- Advanced Interconnects – Components to Systems
- Materials and unit Processes (Metal, dielectric, barrier, Wet, CMP, PVD,
CVD, ALD, ECD, SAM, et.c)
- 3D Integration & Packaging
- Interconnect technologies for Display
- Emerging Interconnect Technology – Flexible, Stretchable, Ultra-Thin PCB, etc.
- Design for Reliability and Failure Analysis
- Modeling and Simulation of Advanced Metallization and IC thermal Management
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