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■ Conference招待講演者予定 ■

Conference keynotes 講演者

小柳 光正(東北大学),A New Smart-Stack Technology for Three-Dimensional LSI

Joaquin Torres, PhD (ST Microelectronics), Advanced BEOL R&D activity at Crolles Alliance

Conference 招待講演者 題目は仮題]

長谷川 利昭 (Sony Corp.), A 65nm/45nm-node interconnect technology featuring ULK stacked hybrid structure

Michael E. Mills (Dow Chemical Co.), Advanced Electronic Materials for ULSI Metallization

Lynne M. Michaelson (Freescale Semiconductor, Inc.), Electroless Deposition of Co-based Alloys for Selective Capping Applications

Changki Hong(Samsung Electronics Co., Ltd),Single Wafer Cleaning Process on Next Generation device

Sarah L. Lane (IBM Corp.), BEOL Process Integration with Cu/SiCOH (k=2.8) Low-k Interconnects at 65 nm Groundrules

小池 淳一 (東北大学), Self-Forming Barrier Process with Mn addition in Cu Metallization