Conference keynotes 講演者
小柳 光正（東北大学），A New Smart-Stack
Technology for Three-Dimensional
LSI
Joaquin Torres, PhD （ST Microelectronics），
Advanced BEOL R&D activity
at Crolles
Alliance
Conference 招待講演者 ［題目は仮題］
長谷川 利昭 （Sony Corp.）， A 65nm/45nm-node
interconnect technology featuring
ULK stacked
hybrid structure
Michael E. Mills （Dow Chemical Co.）， Advanced
Electronic Materials for ULSI
Metallization
Lynne M. Michaelson （Freescale Semiconductor,
Inc.）， Electroless Deposition
of Co-based
Alloys for Selective Capping
Applications
Changki Hong（Samsung Electronics Co., Ltd），Single
Wafer Cleaning Process on Next
Generation
device
Sarah L. Lane （IBM Corp.）， BEOL Process
Integration with Cu/SiCOH (k=2.8)
Low-k Interconnects
at 65 nm Groundrules
小池 淳一 （東北大学）, Self-Forming Barrier
Process with Mn addition in Cu
Metallization
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