講演プログラム(予定)

October 13-14, 2022
★ General Sessions
1) Advanced Integration and Process
2) Advanced Metallization
3) CMP and Cleaning
4) Emerging Technologies (STT-MRAM, ReRAM)
5) Next Generation Interconnect (Carbon, Optical Interconnect etc.)
6) Thin films and Dielectrics
7) 3D Device, TSV and Packaging

   All sessions will be conducted in English.

チュートリアル   講演プログラム


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