Advanced Metallization Conference 2022
31st Asian Session
Oct. 12-14, 2022, Hybrid Conference (on site & online)

Oct.12: Tutorial
Oct.13-14 : Conference

Sponsored by
The Japan Society of Applied Physics

  The ADMETAPlus is heading for the 31st historical meeting and has a long record of important contributions to practical progress for advanced MPU and various memory devices. In recent years, the importance of interconnect technology for realizing low resistance, large integration, rich function, low cost, and high reliability is increasing in various device application fields beyond silicon electronics.
  This conference is focusing interconnects technology and science related to materials, processes, device design, assembly, equipment, cost performance, and characterization. We will conduct comprehensive discussions widely from basics to applications with researchers and engineers from industry, government, and academia. We are looking forward to new developments in interconnect technology fields and contributing to the growth of semiconductor industry in the Asian area. Due to the infection status of the COVID-19, ADMETAPlus 2022 will be held virtual and live Hybrid events.
  ADMETAPlus 2022 General Chair:   Hideaki Machida (Hideaki Machida)

Notation based on the Specified Commercial Transaction Act