{"id":546,"date":"2025-02-21T16:11:26","date_gmt":"2025-02-21T07:11:26","guid":{"rendered":"https:\/\/www.admeta.org\/wp2025\/?post_type=cpt_admeta&p=546"},"modified":"2025-10-07T13:20:46","modified_gmt":"2025-10-07T04:20:46","slug":"invited-2025-en","status":"publish","type":"cpt_admeta","link":"https:\/\/www.admeta.org\/2025\/en\/cpt_admeta\/invited-2025-en","title":{"rendered":"2025-7-en-Invited Speakers"},"content":{"rendered":"

Invited Speakers<\/span><\/strong><\/span><\/p>\n

Plenary Talk 1:\u00a0 <\/span><\/strong>Introducing a New Transistor Architecture to Enable <\/span>Scaling beyond Nanosheet Devices<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 Huiming Bu <\/span>(IBM Research)<\/span><\/p>\n

Plenary Talk 2:\u00a0 <\/span><\/strong>Interconnect Innovations Leading the way for the Leading Edge<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 Christopher J. Wilson <\/span>(imec)<\/span><\/p>\n

Plenary Talk 3:\u00a0 <\/span><\/strong>Metallization Processes for Angstrom Scale Interconnects<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 Robert D. Clark <\/span>(Tokyo Electron Limited)<\/span><\/p>\n

Invited Talk 1:\u00a0 <\/span><\/strong>Paradigm Revolution 2030- Beyond Cliff, Ahead New Paradigm<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 Manabu Tsujimura <\/span>(Ebara Corporation)<\/span><\/p>\n

Invited Talk 2:\u00a0 <\/span><\/strong>Metallic Interfaces of 2D Semiconductor Materials and Devices<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0Won-Jong Yoo <\/span>(Sungkyunkwan Univeristy)<\/span><\/p>\n

Invited Talk 3:\u00a0 <\/span><\/strong>Wet Cleaning Technology for Advanced Semiconductor Device <\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 Masanobu Sato <\/span>(SCREEN Semiconductor Solutions Co., Ltd.)<\/span><\/p>\n

Invited Talk 4:\u00a0 <\/span><\/strong>Advanced Plasma Etching Technologies for Leading-edge Device Fabrication<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0Michikazu Morimoto (Hitachi High-Tech Corporation)<\/span><\/p>\n

Invited Talk 5:\u00a0 <\/span><\/strong>Area-Selective Atomic Layer Deposition through Locally Activated and Deactivated Approaches for Bottom-Up Nanopatterning<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0Woo-Hee Kim <\/span>(Hanyang University)<\/span><\/p>\n

Invited Talk 6:\u00a0 <\/span><\/strong>Scaling in the Future: Atomic Layer Deposition of Metals for Next Generation of Device<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0Chiyu Zhu <\/span>(ASM)<\/span><\/p>\n

Invited Talk 7:\u00a0 <\/span><\/strong>Degradation Mechanisms and Reliability Enhancement of Copper Interconnects<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0Kazuyoshi Ueno and Fumihiro Inoue <\/span>(Yokohama National University)<\/span><\/p>\n

Invited Talk 8:\u00a0 <\/span><\/strong>A novel BEOL Ru interconnect beyond Cu era<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0Seongho Park <\/span>(imec)<\/span><\/p>\n

Invited Talk 9:\u00a0 \u00a0<\/span><\/strong>Wafer bonding W2W Bonding Process Challenges for High Volume Manufacturing<\/span>
\n\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 Yoshihiro Kondo <\/span>(Tokyo Electron Kyushu Limited)<\/span><\/p>\n

Invited Talk 10:\u00a0 <\/span><\/strong>Enabling High Density Packaging with Digital Lithography
\n<\/span>\u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0N<\/span>iranjan Khasgiwale <\/span>(Applied Materials Inc.)<\/span><\/p>\n

\u00a0 \u00a0 \u00a0<\/span><\/p>\n","protected":false},"featured_media":0,"template":"","txo_year":[80],"class_list":["post-546","cpt_admeta","type-cpt_admeta","status-publish","hentry","txo_year-80"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/cpt_admeta\/546","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/cpt_admeta"}],"about":[{"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/types\/cpt_admeta"}],"wp:attachment":[{"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/media?parent=546"}],"wp:term":[{"taxonomy":"txo_year","embeddable":true,"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/txo_year?post=546"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}