{"id":531,"date":"2025-02-21T15:54:14","date_gmt":"2025-02-21T06:54:14","guid":{"rendered":"https:\/\/www.admeta.org\/wp2025\/?post_type=cpt_admeta&#038;p=531"},"modified":"2025-08-28T15:27:03","modified_gmt":"2025-08-28T06:27:03","slug":"award-2025-ja","status":"publish","type":"cpt_admeta","link":"https:\/\/www.admeta.org\/2025\/cpt_admeta\/award-2025-ja","title":{"rendered":"2025-13-ja-\u8868\u5f70"},"content":{"rendered":"<h1 class=\"title\" style=\"text-align: center;\"><span style=\"font-family: 'times new roman', times, serif;\">ADMETA 2024 Award<\/span><\/h1>\n<div id=\"info\">\n<div class=\"border-double\" style=\"text-align: center;\">\n<div class=\"blockAward\" style=\"text-align: center;\">\n<p class=\"price\"><span style=\"font-size: 18pt;\"><strong><span style=\"font-family: 'times new roman', times, serif;\">*** Award ***<\/span><\/strong><\/span><\/p>\n<p class=\"description\"><span style=\"font-family: 'times new roman', times, serif; font-size: 14pt;\">Point Defects in NiAl Interconnects Probed by Positron Annihilation Spectroscopy and Atom Probe Tomography<\/span><\/p>\n<h2 class=\"name\"><span style=\"font-size: 14pt;\"><strong><span style=\"font-family: 'times new roman', times, serif;\">A. Uedono (University of Tsukuba)<\/span><\/strong><\/span><\/h2>\n<\/div>\n<div class=\"blockAward\" style=\"text-align: center;\">\n<p class=\"price\"><span style=\"font-size: 18pt;\"><strong><span style=\"font-family: 'times new roman', times, serif;\">*** Technical Achievement Award ***<\/span><\/strong><\/span><\/p>\n<p class=\"description\"><span style=\"font-family: 'times new roman', times, serif; font-size: 14pt;\">SiO<sub>2<\/sub> Etching Mechanism by Vapor HF\/ Methanol<\/span><\/p>\n<h2 class=\"name\"><span style=\"font-size: 14pt;\"><strong><span style=\"font-family: 'times new roman', times, serif;\">Hiroto Ohtake (Hitachi High-Tech Corporation)<\/span><\/strong><\/span><\/h2>\n<\/div>\n<\/div>\n<div class=\"border-double\">\n<div class=\"blockAward\" style=\"text-align: center;\">\n<p class=\"price\" style=\"text-align: center;\"><span style=\"font-size: 18pt;\"><strong><span style=\"font-family: 'times new roman', times, serif;\">*** Poster Award ***<\/span><\/strong><\/span><\/p>\n<p class=\"description\" style=\"text-align: center;\"><span style=\"font-family: 'times new roman', times, serif; font-size: 14pt;\">Consideration of the effect of suppressing additives in copper wiring formation using EIS measurement<\/span><\/p>\n<h2 class=\"name\" style=\"text-align: center;\"><span style=\"font-family: 'times new roman', times, serif; font-size: 14pt;\">Naoki Okamoto (Osaka Metropolitan University)<\/span><\/h2>\n<\/div>\n<p class=\"description\" style=\"text-align: center;\"><span style=\"font-family: 'times new roman', times, serif; font-size: 14pt;\">Liquid Film Thickness and Agitation Distribution of Two-Fluid Jet Impingement Surface for Post-CMP Cleaning<\/span><\/p>\n<h2 class=\"name\" style=\"text-align: center;\"><span style=\"font-family: 'times new roman', times, serif; font-size: 14pt;\">Naoto Doi (Shizuoka University)<\/span><\/h2>\n<div class=\"blockAward\" style=\"text-align: center;\"><\/div>\n<\/div>\n<\/div>\n","protected":false},"featured_media":0,"template":"","txo_year":[80],"class_list":["post-531","cpt_admeta","type-cpt_admeta","status-publish","hentry","txo_year-80"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/cpt_admeta\/531","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/cpt_admeta"}],"about":[{"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/types\/cpt_admeta"}],"wp:attachment":[{"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/media?parent=531"}],"wp:term":[{"taxonomy":"txo_year","embeddable":true,"href":"https:\/\/www.admeta.org\/2025\/wp-json\/wp\/v2\/txo_year?post=531"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}