{"id":436,"date":"2024-02-08T14:39:01","date_gmt":"2024-02-08T05:39:01","guid":{"rendered":"https:\/\/www.admeta.org\/wp2024\/?post_type=cpt_admeta&p=436"},"modified":"2024-05-09T16:54:51","modified_gmt":"2024-05-09T07:54:51","slug":"topics-2024-en","status":"publish","type":"cpt_admeta","link":"https:\/\/www.admeta.org\/2024\/en\/cpt_admeta\/topics-2024-en","title":{"rendered":"2024-4-en-Topics"},"content":{"rendered":"

Topics of Interest<\/span><\/h1>\n
\n
\n

[Topics of Interest]<\/b><\/span>
\nIntegration:\u00a0<\/b>Interconnection Structure and Performance, <\/span>Parasitic Capacitance, Reliability Technology, Testing and Analysis<\/span>
\nReliability Science and Failure Analysis:\u00a0<\/b>EM, SIV, TDDB, Defect Detection <\/span>and Analysis, Failure Mechanism and Modeling<\/span>
\nMetallization:\u00a0<\/b>PVD, CVD, ALD, Plating, Barrier Metal, New Material, Alloy, Supercritical Fluid, Reflow<\/span>
\nLow-k Dielectric:\u00a0<\/b>CVD, ALD, SOD, Film Properties, New Materials, <\/span>Dielectric Structures (Air Gap), Metrology, etc.<\/span>
\nCMP:\u00a0<\/b>Planarization Technology, Slurry, Pad, Dress, End Point Detection,<\/span>\u00a0Cleaning, Anti-corrosive Technology, etc.<\/span>
\nContact:\u00a0<\/b>Silicide, Interface, Solid Phase Reaction, Shallow Junction, Crystal Properties, Electron Properties, Carrier Transport, etc.<\/span>
\nMEMS\/RF:\u00a0<\/b>Interconnection Structure and Materials, Packaging, <\/span>Fabrication Process Technology, Device Design, etc.<\/span>
\nEmerging Technology:\u00a0<\/b>Active Wiring, Power Electronics, Silicon Photonics, Flexible Electronics, Energy Harvesting, etc.<\/span>
\nBackend Device Technology:\u00a0<\/b>Tech. for Embedding Devices (MRAM,<\/span> PCRAM, ReRAM, DRAM etc.), Materials and Processing of Magnetics,<\/span>\u00a0Phase-Change and Resistive-Change Devices, Electrode, Metallization, etc.<\/span>
\nNano Carbon:\u00a0<\/b>Graphene, Carbon Nanotube, Deposition, Integration,<\/span>\u00a0Electrical Characteristics, Reliability, Evaluation, Analysis, etc.<\/span>
\n3D and Packaging:\u00a0<\/b>TSV, TMV, Stacking Method (CoW, WoW), Thinning,<\/span> Planarization, Bonding, Bump, Stress and Thermal Analysis, Sealing,<\/span>\u00a0Cooling, Reliability.<\/span><\/p>\n<\/div>\n<\/div>\n","protected":false},"featured_media":0,"template":"","txo_year":[65],"class_list":["post-436","cpt_admeta","type-cpt_admeta","status-publish","hentry","txo_year-65"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.admeta.org\/2024\/wp-json\/wp\/v2\/cpt_admeta\/436","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.admeta.org\/2024\/wp-json\/wp\/v2\/cpt_admeta"}],"about":[{"href":"https:\/\/www.admeta.org\/2024\/wp-json\/wp\/v2\/types\/cpt_admeta"}],"wp:attachment":[{"href":"https:\/\/www.admeta.org\/2024\/wp-json\/wp\/v2\/media?parent=436"}],"wp:term":[{"taxonomy":"txo_year","embeddable":true,"href":"https:\/\/www.admeta.org\/2024\/wp-json\/wp\/v2\/txo_year?post=436"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}