{"id":431,"date":"2024-02-08T14:35:19","date_gmt":"2024-02-08T05:35:19","guid":{"rendered":"https:\/\/www.admeta.org\/wp2024\/?post_type=cpt_admeta&p=431"},"modified":"2024-05-13T14:27:31","modified_gmt":"2024-05-13T05:27:31","slug":"info-2024-en","status":"publish","type":"cpt_admeta","link":"https:\/\/www.admeta.org\/2024\/en\/cpt_admeta\/info-2024-en","title":{"rendered":"2024-1-en-about ADMETA"},"content":{"rendered":"

About ADMETA Plus<\/sup><\/i><\/span><\/h1>\n
\n
Advanced Metallization Conference 2024<\/span>
\n33rd<\/span><\/em>\u00a0Asian Session<\/span>
\nOct. 2-4, 2024, Hybrid Conference (on site & online)<\/span><\/p>\n

Oct.2: Tutorial (Japanese)<\/span>
\nOct.3-4 : Conference<\/span><\/p>\n

Sponsored by<\/span>
\nThe Japan Society of Applied Physics<\/span><\/p>\n<\/div>\n

\n

The ADMETA Plus<\/em><\/sup> is heading for the 33rd<\/sup> annual meeting and has a long history of <\/span>important contributions to state-of-the-art interconnect progress for advanced logic and <\/span>memory devices. In recent years, the importance of interconnect technology for realizing low <\/span>resistance, large integration, low cost, high reliability, and 3D-ICs is increasing more and<\/span>
\nmore in various device applications.<\/span><\/p>\n

This conference focuses on interconnects technology related to materials, processes, device, <\/span>circuit design, assembly, equipment, and characterization. We will conduct comprehensive <\/span>discussions widely from basics to applications with researchers and engineers from industry, <\/span>government, and academia. We are looking forward to new developments in interconnect <\/span>technology fields and contributing to the growth of semiconductor industry.<\/span><\/p>\n

The ADMETA Plus<\/em> <\/sup>2024 Theme is \u201cInterconnection from material to VLSI system for a <\/span>Sustainable Development.\u201d Based on the conference theme, I plan to have appealing <\/span>contents, including tutorial (Japanese only), plenary talks, invited talks and poster session.<\/span><\/p>\n

I would like you and your colleagues to submit the contributed papers in wide range of <\/span>aspects in interconnects area. I am looking forward to seeing you in Tokyo.<\/span><\/p>\n

ADMETAPlus <\/sup><\/em>2024 General Chair: Mayumi B. Takeyama (Kitami Institute of Technology)<\/span><\/h1>\n

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