{"id":40,"date":"2023-02-02T16:51:22","date_gmt":"2023-02-02T07:51:22","guid":{"rendered":"https:\/\/www.admeta.org\/wp2023\/?post_type=cpt_admeta&p=40"},"modified":"2023-02-02T16:51:22","modified_gmt":"2023-02-02T07:51:22","slug":"topics-2022-en","status":"publish","type":"cpt_admeta","link":"https:\/\/www.admeta.org\/2023\/en\/cpt_admeta\/topics-2022-en","title":{"rendered":"2022-4-en-Topics"},"content":{"rendered":"\r\n

Topics of Interest<\/h1>\r\n
\r\n
\r\n

[Topics of Interest]<\/b>
\r\n Integration: <\/b>Interconnection Structure and Performance,
\r\n    Parasitic Capacitance, \r\n Reliability Technology, Testing and Analysis
\r\n Reliability Science and Failure Analysis: <\/b>EM, SIV, TDDB, Defect Detection
\r\n   and Analysis, Failure Mechanism and Modeling
\r\n Metallization: <\/b>PVD, CVD, ALD, Plating, Barrier Metal, New Material, Alloy, \r\n   Supercritical Fluid, Reflow
\r\n Low-k Dielectric: <\/b>CVD, ALD, SOD, Film Properties, New Materials,
\r\n   Dielectric Structures (Air Gap), Metrology, etc.
\r\n CMP: <\/b>Planarization Technology, Slurry, Pad, Dress, End Point Detection,
\r\n   Cleaning, Anti-corrosive Technology, etc.
\r\n Contact: <\/b>Silicide, Interface, Solid Phase Reaction, Shallow Junction, Crystal \r\n   Properties, \r\n Electron Properties, Carrier Transport, etc.
\r\n MEMS\/RF: <\/b> \r\n Interconnection Structure and Materials, Packaging,
   \r\n Fabrication Process \r\n Technology, Device Design, etc.
\r\n Emerging Technology: <\/b>Active Wiring, Power Electronics, Silicon Photonics, \r\n   Flexible Electronics, \r\n Energy Harvesting, etc.
\r\n Backend Device Technology: <\/b>Tech. for Embedding Devices (MRAM,
   \r\n PCRAM, ReRAM, DRAM etc.), Materials and Processing of Magnetics,
\r\n    Phase-Change and Resistive-Change Devices, Electrode, Metallization, etc.
\r\n Nano Carbon: <\/b>Graphene, Carbon Nanotube, Deposition, Integration,
\r\n   Electrical Characteristics, Reliability, Evaluation, Analysis, etc.
\r\n 3D and Packaging: <\/b>TSV, TMV, Stacking Method (CoW, WoW), Thinning,
\r\n   Planarization, Bonding, Bump, Stress and Thermal Analysis, Sealing,
\r\n   Cooling, Reliability.<\/p>\r\n <\/div>\r\n<\/div>\r\n\r\n\r\n","protected":false},"featured_media":0,"template":"","txo_year":[13],"class_list":["post-40","cpt_admeta","type-cpt_admeta","status-publish","hentry","txo_year-13"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/cpt_admeta\/40","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/cpt_admeta"}],"about":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/types\/cpt_admeta"}],"wp:attachment":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/media?parent=40"}],"wp:term":[{"taxonomy":"txo_year","embeddable":true,"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/txo_year?post=40"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}