{"id":39,"date":"2023-02-02T16:50:29","date_gmt":"2023-02-02T07:50:29","guid":{"rendered":"https:\/\/www.admeta.org\/wp2023\/?post_type=cpt_admeta&p=39"},"modified":"2023-02-02T16:50:29","modified_gmt":"2023-02-02T07:50:29","slug":"topics-2022-ja","status":"publish","type":"cpt_admeta","link":"https:\/\/www.admeta.org\/2023\/cpt_admeta\/topics-2022-ja","title":{"rendered":"2022-4-ja-\u8b1b\u6f14\u30c6\u30fc\u30de"},"content":{"rendered":"\r\n

\u8b1b\u6f14\u30c6\u30fc\u30de<\/h1>\r\n\r\n
\r\n
\r\n

[\u5bfe\u8c61\u9818\u57df]
\r\n Integration\uff1a<\/b>
\r\n \u914d\u7dda\u69cb\u9020\uff0c\u914d\u7dda\u6027\u80fd\uff0c\u8a55\u4fa1\u30fb\u89e3\u6790\u6280\u8853 \u306a\u3069
\r\n Reliability Science and Failure Analysis\uff1a<\/b>
\r\n EM\uff0cSIV\uff0cTDDB\uff0c\u6b20\u9665\u691c\u67fb\uff0c\u30e2\u30c7\u30ea\u30f3\u30b0 \u306a\u3069
\r\n Metallization\uff1a<\/b>
\r\n \u6210\u819c\u6280\u8853\uff0c\u914d\u7dda\u6750\u6599\uff0c\u30d0\u30ea\u30a2\u30e1\u30bf\u30eb \u306a\u3069
\r\n Low-k Dielectric\uff1a<\/b>
\r\n \u6210\u819c\u65b9\u6cd5\uff0c\u819c\u7279\u6027\uff0c\u65b0\u6750\u6599\uff0c\u69cb\u9020\uff08Air gap \u4ed6\uff09\uff0c\u8a55\u4fa1\u6280\u8853 \u306a\u3069
\r\n CMP\uff1a<\/b>
\r\n \u5e73\u5766\u5316\uff0c\u30b9\u30e9\u30ea\u30fc\uff0c\u30d1\u30c3\u30c9\uff0c\u30c9\u30ec\u30b9\uff0c\u6d17\u6d44\uff0c\u9632\u98df \u306a\u3069
\r\n Contact\uff1a<\/b>
\r\n \u30b7\u30ea\u30b5\u30a4\u30c9\uff0c\u6d45\u63a5\u5408\uff0c\u96fb\u5b50\u7269\u6027\uff0c\u56fa\u76f8\u53cd\u5fdc\uff0c\u7d50\u6676\u7269\u6027 \u306a\u3069
\r\n MEMS\/RF\uff1a<\/b>
\r\n \u914d\u7dda\u69cb\u9020\u30fb\u6750\u6599\uff0c\u30d1\u30c3\u30b1\u30fc\u30b8\u30f3\u30b0\uff0c\u88fd\u9020\u30d7\u30ed\u30bb\u30b9\uff0c\u30c7\u30d0\u30a4\u30b9 \u306a\u3069
\r\n Emerging Technology\uff1a<\/b>
\r\n \u30a2\u30af\u30c6\u30a3\u30d6\u914d\u7dda\uff0c\u30d1\u30ef\u30fc\u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9\uff0c\u30b7\u30ea\u30b3\u30f3\u30d5\u30a9\u30c8\u30cb\u30af\u30b9\uff0c
\r\n \u30d5\u30ec\u30ad\u30b7\u30d6\u30eb\u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9\uff0c\u30a8\u30cd\u30eb\u30ae\u30fc\u30cf\u30fc\u30d9\u30b9\u30c6\u30a3\u30f3\u30b0 \u306a\u3069
\r\n Backend Devices\uff1a<\/b>
\r\n \u591a\u5c64\u914d\u7dda\u6df7\u8f09\u30c7\u30d0\u30a4\u30b9 (MRAM\uff0cPCRAM\uff0cReRAM \u4ed6)\uff0c\u96fb\u6975\u6280\u8853,
\r\n \u65b0\u6750\u6599 \u306a\u3069
\r\n Nanocarbon Interconnects\uff1a<\/b>
\r\n \u30b0\u30e9\u30d5\u30a7\u30f3\uff0c\u30ca\u30ce\u30c1\u30e5\u30fc\u30d6\uff0c\u30d7\u30ed\u30bb\u30b9\uff0c\u30a4\u30f3\u30c6\u30b0\u30ec\u30fc\u30b7\u30e7\u30f3\uff0c
\r\n \u4fe1\u983c\u6027 \u306a\u3069
\r\n 3D and Packaging\uff1a<\/b>
\r\n TSV\uff0cTMV\uff0c\u5f62\u6210\u30d7\u30ed\u30bb\u30b9\uff0c\u7a4d\u5c64\u30d7\u30ed\u30bb\u30b9\uff08COW\uff0cWOW\uff09\uff0c
\r\n \u8584\u5316\u30fb\u5e73\u5766\u5316\uff0c\u63a5\u7740\uff0c\u30d0\u30f3\u30d7\uff0c\u5fdc\u529b\u30fb\u71b1\u89e3\u6790\uff0c\u5c01\u6b62\uff0c
\r\n \u51b7\u5374\uff0c\u4fe1\u983c\u6027 \u306a\u3069<\/p>\r\n <\/div>\r\n<\/div>\r\n\r\n","protected":false},"featured_media":0,"template":"","txo_year":[13],"class_list":["post-39","cpt_admeta","type-cpt_admeta","status-publish","hentry","txo_year-13"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/cpt_admeta\/39","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/cpt_admeta"}],"about":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/types\/cpt_admeta"}],"wp:attachment":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/media?parent=39"}],"wp:term":[{"taxonomy":"txo_year","embeddable":true,"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/txo_year?post=39"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}