{"id":33,"date":"2023-02-02T14:38:20","date_gmt":"2023-02-02T05:38:20","guid":{"rendered":"https:\/\/www.admeta.org\/wp2023\/?post_type=cpt_admeta&#038;p=33"},"modified":"2023-04-04T14:39:57","modified_gmt":"2023-04-04T05:39:57","slug":"info-2022-en","status":"publish","type":"cpt_admeta","link":"https:\/\/www.admeta.org\/2023\/en\/cpt_admeta\/info-2022-en","title":{"rendered":"2022-1-en-about ADMETAplus"},"content":{"rendered":"\r\n<h1 class=\"title\">About ADMETA <i><sup>Plus<\/sup><\/i><\/h1>\r\n<div id=\"info\">\r\n<div class=\"bold alignCenter\">Advanced Metallization Conference 2022<br \/>31<sup>st<\/sup> Asian Session<br \/>Oct. 12-14, 2022, Hybrid Conference (on site &amp; online)<br \/><br \/>Oct.12: Tutorial<br \/>Oct.13-14 : Conference<br \/><br \/>Sponsored by<br \/>The Japan Society of Applied Physics <br \/><br \/>Co-Sponsored by<br \/>The Institute of Electronics, Infomration and Communication Engineers (IEICE)<br \/>The Japan Institute of Metals and Materials (JIM)<br \/>The Surface Finishing Society of Japan (SFJ)<br \/>The Japan Society for Precision Engineering (JSPE)<br \/>The Institute of Electrical Engineers of Japan (IEEJ)<br \/>The Japan Institute of Electronics Packaging (JIEP)<br \/>The Japan Society of Vacuum and Surface Science (JVS)<br \/>IEEE EDS Japan Joint Chapter<br \/>ECS Japan Section <br \/><br \/>Financially supported by <br \/>The Foundation for Technology Promotion of Electronic Circuit Board<br \/><br \/><\/div>\r\n<div class=\"border-double\">\u2003 The ADMETA<i><sup>Plus <\/sup><\/i> is heading for the 31<sup>st<\/sup> historical meeting and has a long record of important contributions to practical progress for advanced MPU and various memory devices. In recent years, the importance of interconnect technology for realizing low resistance, large integration, rich function, low cost, and high reliability is increasing in various device application fields beyond silicon electronics. <br \/>\u2003 This conference is focusing interconnects technology and science related to materials, processes, device design, assembly, equipment, cost performance, and characterization. We will conduct comprehensive discussions widely from basics to applications with researchers and engineers from industry, government, and academia. We are looking forward to new developments in interconnect technology fields and contributing to the growth of semiconductor industry in the Asian area. Due to the infection status of the COVID-19, ADMETA<i><sup>Plus <\/sup><\/i>2022 will be held virtual and live Hybrid events.<br \/>\r\n<p class=\"alignCenter\">ADMETA<i><sup>Plus <\/sup><\/i> 2022 General Chair:\u3000Hideaki Machida (Hideaki Machida)<\/p>\r\n<\/div>\r\n<div id=\"sponsor\">\r\n<div class=\"wrapSponsor\">\r\n<h2>\u00a0<\/h2>\r\n<h2 class=\"sponsor-title\">[Co-Organizer]<\/h2>\r\n<p class=\"single\"><a><img decoding=\"async\" src=\"\/banner\/SAMT.jpg\" width=\"160\" \/><\/a><\/p>\r\n<\/div>\r\n<div class=\"wrapSponsor\">\r\n<h2 class=\"sponsor-title\">[Exhibitor&#8217;s Link]<\/h2>\r\n<p class=\"single\"><a href=\"http:\/\/www.kisoh-seicho.com\/Englishind.htm#Englishind\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/GPG.jpg\" width=\"160\" \/><\/a><\/p>\r\n<\/div>\r\n<div class=\"wrapSponsor\">\r\n<h2 class=\"sponsor-title\">[Sponsors&#8217; Link]<\/h2>\r\n<div class=\"boxLink wrapFlex\"><a href=\"https:\/\/www.tel.com\/?_fsi=D9jPZzKe\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/TEL.png\" width=\"130\" \/><\/a> <a href=\"https:\/\/www.m-chemical.co.jp\/en\/index.html\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/Mitsubishi.jpg\" width=\"160\" \/><\/a> <a href=\"https:\/\/www.ebara.co.jp\/en\/precision\/\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/ebara-logo.jpg\" width=\"160\" \/><\/a> <a href=\"https:\/\/www.ulvac.co.jp\/en\/\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/ulvac.jpg\" width=\"160\" \/><\/a> <a href=\"https:\/\/www.appliedmaterials.com\/jp\/ja.html\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/AMATlogo-175w.jpg\" width=\"160\" \/><\/a> <a href=\"https:\/\/www.lamresearch.com\/ja\/\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/LamResearch.jpg\" width=\"160\" \/><\/a> <a href=\"https:\/\/www.westerndigital.com\/ja-jp\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/WesternDigital.jpg\" width=\"160\" \/><\/a> <a href=\"https:\/\/www.sony-semicon.co.jp\/e\/\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/sony_logo_blue_RGB.png\" width=\"170\" \/><\/a> <a href=\"https:\/\/www.nmm.jx-group.co.jp\/\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"\/banner\/jx_e.png\" width=\"160\" \/><\/a><\/div>\r\n<\/div>\r\n<\/div>\r\n<p><\/p>\r\n<p>&nbsp;<\/p>\r\n<\/div>\r\n\r\n<p>&nbsp;<\/p>","protected":false},"featured_media":0,"template":"","txo_year":[13],"class_list":["post-33","cpt_admeta","type-cpt_admeta","status-publish","hentry","txo_year-13"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/cpt_admeta\/33","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/cpt_admeta"}],"about":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/types\/cpt_admeta"}],"wp:attachment":[{"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/media?parent=33"}],"wp:term":[{"taxonomy":"txo_year","embeddable":true,"href":"https:\/\/www.admeta.org\/2023\/wp-json\/wp\/v2\/txo_year?post=33"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}