Conference Topics of Interest
Integration: Structure, Performance, Resistance, Capacitance,
Evaluation, Analysis, etc.
Reliability Science and Failure Analysis: EM, SIV, TDDB, Measurement, Evaluation,
Defect Inspection, Yield Improvement, Process
Dispersion Modeling, etc.
Metallization: PVD, CVD, ALD, ECD, Barrier Metal, Nucleation
Layer, Seed Layer, Alloy, Supercritical,
New Materials, etc.
Low-k Dielectric: CVD, ALD, SOD, Porous Films, New Materials,
Adhesion, Interface Reaction, Air Gap, Evaluation,
etc.
Contact: Silicide, Interface, Solid Phase Reaction,
Shallow Junction, Crystal Properties, Electron
Properties, Carrier Transport, Parasitic
Resistance, etc.
3D: COW, WOW, Thinning, Bonding, TSV, TMV,
Bump, Individuating, Redistribution Layer,
Cooling, Reliability, etc.
MEMS/RF: Structure, Materials, Packaging, Deposition
Tech., Etching Tech., CMP, Electroplating,
Switch, Inductor, Varactor, Resonator, Transmission
Line, etc.
Emerging Technology: Active Wiring, Memristor, Sensor, Electronic
Luminescence, Silicon Photonics, Power Electronics,
Flexible Electronics, Energy Harvesting,
etc.
Organized-Session Topics
of Interest
Backend Devices Session: Tech. for Embedding Devices (MRAM, PCRAM,
ReRAM, DRAM etc.), Science and Process of
Magnetic, Phase-Change and Resistive-Change
Devices, Electrode, Metallization, etc.
CMP Session: Planarization Technology, Slurry, Pad,
Dress, End Point Detection, Cleaning, Anti-corrosive
Technology, etc.
Nanocarbon Interconnects Session: Graphene, Carbon Nanotube, Deposition,
Growth, Integration, Electrical Characteristics,
Reliability, Evaluation, Analysis, Doping,
etc.
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