Advanced Metallization Conference 2011: 21st
Asian Session
Sep. 12-15, 2011,
Toyosu Campus, Shibaura Institute
of Technology,
Tokyo
Sep. 12: Tutorial
Sep. 13-15 : Conference
(MtM Seission : Sep. 15)
Sponsored by
The Japan Society of Applied
Physics
Supported by
the Surface Finishing Society
of Japan,
The Institute of Electrical Engineers
of
Japan,
The Japan Society for Precision
Engineering,
the Institute of Electronics,
Information and Communication
Engineers,
the Japan Institute of Metals,
IEEE EDS Japan Chapter,
the Vacuum Society of Japan,
The Surface Science Society of
Japan.
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Dear Sir/Madam,
Advanced Metallization Conference 2011, 21st
Asian Session: ADMETAPlus 2011 will be held from September 12 to 15,
2011. The conference is
organized to stimulate
and enhance the research
and development
of ULSI interconnect technology;
and each
year since 1989 the conference
has been held
at about the same time
in both Japan and
USA, and has showcased
remarkable interconnect
technology development
in Asia.
Current active development of Cu multilayer
wiring technology is aimed
at feature sizes
of less than 50nm. The
application of Cu
wiring has also been broadened
to the memory
market and is widely used
for Flash and DRAM.
However, securing good
reliability on electro-migration
and low-k films in Low-k/Cu
wiring schemes
is still an important topic.
Moreover, there
is advancement in the introduction
of metal
deposition for transistor
surroundings such
as for Silicide and Metal
Gate, etc. The
progress of miniaturization
technology for
packaging is rapid, and
concepts for integrated
wiring technology between
Si chips and mounting
substrates are requested.
Especially, the
3D wiring technology is
paid to attention
as one of the directionality
in the future.
Contributions of papers
are highly solicited
addressing these topics,
and related areas
such as materials, interconnect
design, reliability,
equipment, and cost reduction,
etc. where
there is no shortage of
problems to be solved.
On this conference, the
organizer system
of each session is introduced
for more attractive
program planning.
In addition to the main conference, " MtM (More than Moore) special session" will be held to discuss More than
Moore technology in which
the proposal and
development are actively
performed as the
post-scaling technology.
This conference offers an excellent opportunity
to learn about the most
recent R&D activities
in interconnect metal technology
and related
fields from around the
world. Now is the
time for you to join us.
ADMETAPlus 2011 Chairman:
Kazuyoshi Ueno (Shibaura
Institute of Technology)
ADMETAPlus 2011 Program Chairman:
Jun-ichi Koike (Tohoku
University)
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