Advanced Metallization Conference 2007: 17th
Asian Session
Oct. 22-24, 2007,
Sanjo Conferene Hall, The Univ. of
Tokyo,
Tokyo
Oct. 22: Tutorial
Sep. 23-24 : Conference
Sponsored by
ADMETA Committee,The Japan
Society of Applied Physics Silicon Technology
Division
In conjunction with
The Institute of Electrochemical Engineering
of Japan,The
Japan Institute of Metals, IEEE Japan
Council, IEEE EDS Japan
Chapter,The
Surface Finishing Society of JapanThe
Institute
of Electronics,
Information and Communication Engineers,The
Vacuum Society of Japan, The Surface Science Society of Japan,Japan
Society of Precision Engineering
Dear Sir,
Advanced metallization Conference 2007: 17th
Asian Session, ADMETA 2007 will
be held in
October 22 to 24, 2007. The conference
has
been organized for almost twenty
years to
stimulate and enhance the R&D
of the
ULSI interconnect technology.
Since 1995,
the conference has been held
both in Japan
and USA every year, aiming at
remarkable
development in the interconnect
technology
in Asia. In these days, most
of the efforts
in BEOL technology have been
given to realize
the Low-k/Cu interconnect module.
Reduction
in dielectric constant of insulator
material
as well as the interconnect reliability
issues
are the major R&D target
in this field.
Also, new materials are being
introduced
for FEOL and package technology
in accordance
with various requirements to
realize a high
performance and downsizing. Contribute
papers
which relate not only to interconnect
technology
but to wide area such as materials
and processing
science, modeling, and integration
issues.
Would be highly solicited. The
conference
would offer very important opportunity
to
learn the most recent R&D
activities
in the related field in the world.
Now it
is the time for you to join us.
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